No abstract

Accurate dynamic mechanical measurements have been performed on semicrystalline isotactic polypropylene over wide ranges of temperature and frequency. A mechanical model has been used to analyze experimental results in order to separate the behavior of amorphous and crystalline phases. The two main α and β relaxation processes have been analyzed. The β relaxation, related to the glass‐rubber transition of the amorphous fraction, has been studied with the help of a physical model. The behavior is similar to that of a wholly amorphous polymer, with two characteristics: a high rubbery plateau, indicating a crosslinking effect by the crystalline phase, and a strong effect of interfaces in shear strain. Experimental data suggest the α relaxation originates within the crystalline phase and that it can be attributed to diffusion of defects. The amorphous phase plays an important role in this process, because it has to adapt itself by cooperative movements to respect the compatibility of deformations of the two phases. The formalism developed here rationalizes experimental results obtained with samples having different thermal histories.

This work discusses measurement of thermal conductivity (k) of films using a scanning hot probe method in the 3ω mode and investigates the calibration of thermal contact parameters, specifically the thermal contact resistance (R(th)C) and thermal exchange radius (b) using reference samples with different thermal conductivities. R(th)C and b were found to have constant values (with b = 2.8 ± 0.3 μm and R(th)C = 44,927 ± 7820 K W(-1)) for samples with thermal conductivity values ranging from 0.36 W K(-1) m(-1) to 1.1 W K(-1) m(-1). An independent strategy for the calibration of contact parameters was developed and validated for samples in this range of thermal conductivity, using a reference sample with a previously measured Seebeck coefficient and thermal conductivity. The results were found to agree with the calibration performed using multiple samples of known thermal conductivity between 0.36 and 1.1 W K(-1) m(-1). However, for samples in the range between 16.2 W K(-1) m(-1) and 53.7 W K(-1) m(-1), calibration experiments showed the contact parameters to have considerably different values: R(th)C = 40,191 ± 1532 K W(-1) and b = 428 ± 24 nm. Finally, this work demonstrates that using these calibration procedures, measurements of both highly conductive and thermally insulating films on substrates can be performed, as the measured values obtained were within 1-20% (for low k) and 5-31% (for high k) of independent measurements and/or literature reports. Thermal conductivity results are presented for a SiGe film on a glass substrate, Te film on a glass substrate, polymer films (doped with Fe nano-particles and undoped) on a glass substrate, and Au film on a Si substrate.