Articles you may be interested inMicrostructural comparisons of ultrathin Cu films deposited by ion-beam and dc-magnetron sputtering J. Appl. Phys. 97, 093301 (2005); 10.1063/1.1886275Effect of the substrate bias voltage on the physical characteristics of copper films deposited by microwave plasma-assisted sputtering techniqueThe biased target deposition apparatus described herein uses a low energy ion source. The ions are generated at energies for which the sputter yield is negligible for typical construction materials, so that there is no need for expensive optics to focus the ions on the target. The bias of the target provides the energy for sputtering the target material, in addition to restricting the sputtering to the target. Using the biased target technique, copper films were deposited with an average resistivity of about 2.5 ⍀ cm at a thickness of 1000 Å. This apparatus is well suited to the deposition of very thin (р1000 Å͒ high quality films, such as used in recent magnetoresistive devices. It is also well suited for use in compact and reliable multitarget systems to deposit such films.

We report on the development of a one-dimensional Ion Beam Figuring (IBF) system for x-ray mirror polishing. Ion beam figuring provides a highly deterministic method for the final precision figuring of optical components with advantages over conventional methods. The system is based on a state of the art sputtering deposition system outfitted with a gridded radio frequency inductive coupled plasma ion beam source equipped with ion optics and dedicated slit developed specifically for this application. The production of an IBF system able to produce an elongated removal function rather than circular is presented in this paper, where we describe in detail the technical aspect and present the first obtained results.

Low energy ion beam mixing as a tool for multilayer xray mirror fabricationA new type of ion beam probe is described that measures the angular distribution of energetic ions and, through their sputtering effects, energetic neutrals as well. This probe does not require either complicated motion actuators or very sensitive electrical measurements in the adverse environment of an ion beam, but instead performs the measurement through the sputter etching of a multilayer sample with contrasting metal colors. This probe was tested and found to provide a half-width at half-maximum reproducibility of about Ϯ0.3 deg. After use, the probe sample provides a permanent record of the angular distribution of the ion beam at the target location tested. Because no electrical contacts are required, the probe can even be attached to a moving stage to measure the effective angular distribution of an ion beam while being carried through a complicated planetary pattern. Using this probe, the low divergence and paraxial beam from an ion source with 30 cm flat graphite grids were documented. This probe, in conjunction with profiles obtained with a Faraday probe, allows full global and internal ion beam characterization. It is significant that the minimum divergences obtained in this investigation were 40-60 percent lower than the minimum divergences obtained from earlier tests with small arrays of apertures.