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A silver molecular ink platform formulated for screen, inkjet, and aerosol jet printing is presented. A simple formulation comprising silver neodecanoate, ethyl cellulose, and solvent provides improved performance versus that of established inks, yet with improved economics. Thin, screen-printed traces with exceptional electrical (<10 mΩ/□/mil or 12 μΩ·cm) and mechanical properties are achieved following thermal or photonic sintering, the latter having never been demonstrated for silver-salt-based inks. Low surface roughness, submicron thicknesses, and line widths as narrow as 41 μm outperform commercial ink benchmarks based on flakes or nanoparticles. These traces are mechanically robust to flexing and creasing (less than 10% change in resistance) and bind strongly to epoxy-based adhesives. Thin traces are remarkably conformal, enabling fully printed metal-insulator-metal band-pass filters. The versatility of the molecular ink platform enables an aerosol jet-compatible ink that yields conductive features on glass with 2× bulk resistivity and strong adhesion to various plastic substrates. An inkjet formulation is also used to print top source/drain contacts and demonstrate printed high-mobility thin film transistors (TFTs) based on semiconducting single-walled carbon nanotubes. TFTs with mobility values of ∼25 cm V s and current on/off ratios >10 were obtained, performance similar to that of evaporated metal contacts in analogous devices.

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Discussion of the Bistatic Scattering Coefficients Averaged over 30 Realizations Figure 7 shows the simulation of the bistatic-scattering coefficients averaged over 30 realizations through the UV method. The rms heights are 0.03, 0.06, and 0.09, respectively, and all of their correlation lengths are 1.03, the permittivity of the dielectric rough surface is 1 ϭ 10.8 Ϫ j1.6. The surface lengths are 8 ϫ 8 wavelengths and the incidence angle is 30°. The reflectivity of the dielectric rough surface is calculated through integral over above space. Figure 7 shows that the backscattering coefficient will increase with rms height increasing, as does the reflectivity. The CPU time of the UV method will also increase for iteration number's increase. Meanwhile, the specular scattering coefficient will decrease, as opposed to increase of the rms height. CONCLUSIONIn this paper, the UV-MLP method has been used for a rapid solution of the integral equation in 3D dielectric rough-surface scattering. The method can be applied to 3D PEC rough-surface scattering, and volume scattering of moderate-size particles using high-order spherical-wave Green's functions. Presently, the case of vector electromagnetic wave scattering by lossy dielectric random rough-surfaces is being studied.