We describe a new approach to logic devices interconnection by the inductive coupling via a ferromagnetic film. The information among the distant devices is transmitted in a wireless manner via a magnetic field produced by spin waves propagating in the ferromagnetic film, referred to as the spin wave bus. As an alternative approach to the transistor-based architecture, logic circuits with spin wave bus do not use charge as an information carrier. A bit of information can be encoded into the phase or the amplitude of the spin wave signal. We present experimental data demonstrating inductive coupling through the 100nm thick NiFe and CoFe films at room temperature. The performance of logic circuits with spin wave bus is illustrated by numerical modeling based on the experimental data. Potentially, logic circuits with spin wave bus may resolve the interconnect problem and provide "wireless" read-in and read-out. Another expected

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