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In large scale applications, such as SMES, motors and generators, High Temperature Superconducting (HTS) magnets are constructed with many stacks of the double-pancake coils connected in series. In spite of its higher thermal stability, HTS magnet can experience a severe quench, which can resulted from a very small portion. From HTS magnet design point of view, it is very important to predict the possibility of occurrence quench in the designed magnet to provide a suitable quench protection device. In this paper a highly instrumented HTS race track double-pancake coil was prepared to examine the quench development characteristics. It is wound using the Bi-2223 tape. Many voltage taps, cryogenic thermocouples and heater were installed in the winding. Conduction cooling method is adapted for the convenience of temperature. Quench development in the coil was measured under different operating current. The experimental details and results are presented in this paper.

Challenges associated with local stress concentration on layers in stretchable devices under mechanical deformation by bodily motions, which causes strain‐induced signal interference and generates cracks, constitute one of the remaining issues for realization of skin‐attachable stretchable electronics. Herein, a new structural engineering approach is introduced for an elastomeric substrate, a microtrench‐patterned stretchable substrate, in which microtrenches are formed on the substrate backside, effectively mitigating local stress on the surface layers under stretching. Combining the microtrench pattern on the backside and 3D stress‐absorbing microstructured surface on the frontside of the elastomeric substrate for stress engineering results in effective suppression of stress concentration on the crack‐prone carbon paste electrode and piezoresistive pressure sensing layer on the frontside surface due to stress‐concentration on microtrench pattern and, in turn, minimal change in their resistance with deformation. This approach using a simple and facile method to minimize stress in device layers under motion‐induced deformation has great potential for applications of diverse materials for body‐attachable stretchable electronics with minimal strain‐responsiveness.

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