Mechanical properties of materials have long been one of the most fundamental and studied areas of materials science for a myriad of applications. Recently, mechanical metamaterials have been shown to possess extraordinary effective properties, such as negative dynamic modulus and/or density, phononic bandgaps, superior thermoelectric properties, and high specific energy absorption. To obtain such materials on appropriate length scales to enable novel mechanical devices, it is often necessary to effectively design and fabricate micro-/nano- structured materials. In this Review, various aspects of the micro-/nano-structured materials as mechanical metamaterials, potential tools for their multidimensional fabrication, and selected methods for their structural and performance characterization are described, as well as some prospects for the future developments in this exciting and emerging field.

The engineering of optical and acoustic material functionalities via construction of ordered local and global architectures on various length scales commensurate with and well below the characteristic length scales of photons and phonons in the material is an indispensable and powerful means to develop novel materials. In the current mature status of photonics, polymers hold a pivotal role in various application areas such as light-emission, sensing, energy, and displays, with exclusive advantages despite their relatively low dielectric constants. Moreover, in the nascent field of phononics, polymers are expected to be a superior material platform due to the ability for readily fabricated complex polymer structures possessing a wide range of mechanical behaviors, complete phononic bandgaps, and resonant architectures. In this review, polymer-centric photonic and phononic crystals and metamaterials are highlighted, and basic concepts, fabrication techniques, selected functional polymers, applications, and emerging ideas are introduced.

Oxide-based two-terminal resistive random access memory (RRAM) is considered one of the most promising candidates for next-generation nonvolatile memory. We introduce here a new RRAM memory structure employing a nanoporous (NP) silicon oxide (SiOx) material which enables unipolar switching through its internal vertical nanogap. Through the control of the stochastic filament formation at low voltage, the NP SiOx memory exhibited an extremely low electroforming voltage (∼ 1.6 V) and outstanding performance metrics. These include multibit storage ability (up to 9-bits), a high ON-OFF ratio (up to 10(7) A), a long high-temperature lifetime (≥ 10(4) s at 100 °C), excellent cycling endurance (≥ 10(5)), sub-50 ns switching speeds, and low power consumption (∼ 6 × 10(-5) W/bit). Also provided is the room temperature processability for versatile fabrication without any compliance current being needed during electroforming or switching operations. Taken together, these metrics in NP SiOx RRAM provide a route toward easily accessed nonvolatile memory applications.

SiOx memory devices that offer significant improvement in switching performance were fabricated at room temperature with conducting interlayers such as Pd, Ti, carbon, or multilayer graphene. In particular, the Pd-interlayer SiOx memory devices exhibited improvements in lowering the electroforming voltages and threshold voltages as the number of inserted Pd layers was increased, as compared to a pure SiOx memory structure. In addition, we demonstrated that the Pd-interlayer SiOx junction fabricated on a flexible substrate maintained low electroforming voltage and mechanically stable switching properties. From these observations, a possible switching mechanism is discussed based on the formation of individual conducting paths at the weakest edge regions of each SiOx film, where the normalized bond-breaking probability of SiOx is influenced by the voltage and the thickness of SiOx. This fabrication approach offers a useful structural platform for next-generation memory applications for enhancement of the switching properties while maintaining a low-temperature fabrication method that is even amenable with flexible substrates.

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