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We measured the energy distributions of negative ions during reactive sputtering of silicon in oxygen. Various oxygen containing negative ions are formed in the cathode sheath or directly at the sputter target, respectively. These negative ions are accelerated away from the cathode by the electrical field, and can be detected using a mass spectrometer facing the sputter magnetron. The origin of each ion can be determined from peak structures in the energy distribution. Additionally the flux of different negative ions provides information on poisoning of the target by oxide films.

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