In nanometric cutting process, the actual material removal can take place at atomic level, which makes the observation of machining phenomena and the measurement of cutting parameters difficult or impossible in experiments. However, it is crucial to investigate the cutting process in nanoscale. In this work, molecular dynamics (MD) is used to study effects of cutting parameters on nanometric cutting process with the aid of EAM potential. The result of the simulation shows that higher cutting speed leads to a rough machined surface with a relative large deformation in workpiece. It is found that a smaller cutting depth results in less plastic deformation and fewer dislocations in workpiece, and also results in a smoother machined surface. Rake angle has big effect on the chip formation, potential energy and the machined surface.

In nanometric cutting process, the actual material removal can take place at atomic level, which makes it difficult or impossible to observe the machining phenomena and measure the cutting parameters in experiments. However, it is crucial to investigate the cutting process in nanoscale. In this study, the molecular dynamics (MD) method is employed to model and simulate the process of cutting monocrystalline copper. The two-body Morse potential and the many-body EAM potential are used for the atoms interaction in the workpiece to study the effect of different potential function on the simulation results. It is found that there are no obvious differences in the chip formation between Morse and EAM potential, but the Morse potential results in higher potential energy and more chips generated in the cutting process.