Molecular Dynamics Modeling and Effects of Cutting Parameters on Nanometric Cutting Process

Wang, Jia Chun; Zhang, Ji Min; Wu, Feng; Li, Na

doi:10.4028/www.scientific.net/amr.60-61.435

Cited by 3 publications

(2 citation statements)

References 10 publications

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“…( 1), and the parameters of the potential function are listed in Table 1. In previous studies, the interaction between tool and workpiece will be described by pair potential function [19] [20]. Therefore, the interaction between C-Ce and C-La is described by the L-J potential function in this study.…”

Section: Introductionmentioning

confidence: 97%

Nanometric cutting mechanism of cerium-lanthanum alloy

Zhao

Lai

2022

Preprint

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Molecular dynamics (MD) simulation is an effective approach to reveal the atomic-scale details of the material removal mechanism in nanometric cutting. In this study, through a MD simulation, we analyze the effects of cutting speed and cutting depth on cutting force and subsurface deformation of the cerium–lanthanum alloy during nanometric cutting. The results illustrate that the dislocations, stacking faults, and phase transitions occur on the material subsurface during the cutting process. The dislocations are mainly Shockley partial dislocation, and increasing the temperature and pressure during the cutting process leads to the transformation of γ-Ce (FCC) into β-Ce (HCP) and δ-Ce (BCC). β-Ce is mainly distributed in the stacking fault area, while δ-Ce is distributed in the boundary area between the dislocation atoms and γ-Ce atoms. The cutting speed and cutting depth are important factors affecting the distribution of subsurface damage. A thicker subsurface deformed layer on the machined surface, comprising dislocations, stacking faults, and lattice defects, is generated with an increase in the cutting speed and cutting depth. Simultaneously, the cutting speed and cutting depth significantly affect the cutting force, material removal rate, and generated subsurface state. The fluctuations in the cutting force are related to the generation and disappearance of dislocations. The higher the cutting speed and the deeper the cutting depth, the more phase-transition atoms on the subsurface.

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Section: Introductionmentioning

confidence: 97%

Nanometric cutting mechanism of cerium-lanthanum alloy

Zhao

Lai

2022

Preprint

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“…They observed the characteristic of ductile machining process during the cutting process and acquired high machined surface quality. Wang Jiachun et al [2] studied the effects of cutting parameters on nanometric cutting process by MD. They found cutting depth, cutting speed and rake angle had an influence on roughness of machined surface.…”

Section: Introductionmentioning

confidence: 99%

Effect of Surface Relaxation on Characteristics of Nanomachined Surface

Tang

Liu

et al. 2011

AMR

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With the development of Micro-electro-mechanical systems (MEMS) and Nano-electro-mechanical systems (NEMS), dimension of their parts is required to nanometer scale, and the characteristics of machined-surface of nano-scale parts affect strongly its application. Surface relaxation plays an important role to the characteristics of the machined-surface. In this paper, machined-surface of monocrystal copper used as the specimen of surface relaxation, and its surface relaxation process is simulated. The influences of surface relaxation on surface energy, atom array, surface roughness, surfaces hardness and surface residual stress of the monocrystal copper are analyzed. Results show that surface energy and surface hardness decrease due to relaxation; work-hardening can’t be completely eliminated by the relaxation; compression residual stress of the machined surface is changed gradually to tensile stress during the relaxation. These research results are very helpful to the application of nano-machined parts.

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Nanometric Cutting Mechanism of Cerium–Lanthanum Alloy

Zhao,

Lai,

Fang

2023

Chin. J. Mech. Eng.

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Cerium–lanthanum alloy is widely used in the green energy industry, and the nanoscale smooth surface of this material is in demand. Nanometric cutting is an effective approach to achieving the ultra-precision machining surface. Molecular dynamics (MD) simulation is usually used to reveal the atomic-scale details of the material removal mechanism in nanometric cutting. In this study, the effects of cutting speed and undeformed chip thickness (UCT) on cutting force and subsurface deformation of the cerium–lanthanum alloy during nanometric cutting are analyzed through MD simulation. The results illustrate that the dislocations, stacking faults, and phase transitions occur in the subsurface during cutting. The dislocations are mainly Shockley partial dislocation, and the increase of temperature and pressure during the cutting process leads to the phase transformation of γ-Ce (FCC) into β-Ce (HCP) and δ-Ce (BCC). β-Ce is mainly distributed in the stacking fault area, while δ-Ce is distributed in the boundary area between the dislocation atoms and γ-Ce atoms. The cutting speed and UCT affect the distribution of subsurface damage. A thicker deformed layer including dislocations, stacking faults and phase-transformation atoms on the machined surface is generated with the increase in the cutting speed and UCT. Simultaneously, the cutting speed and UCT significantly affect the cutting force, material removal rate, and generated subsurface state. The fluctuations in the cutting force are related to the generation and disappearance of dislocations. This research first studied the nanometric cutting mechanism of the cerium–lanthanum ally, providing a theoretical basis for the development of ultra-precision machining techniques of these materials.

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Molecular Dynamics Modeling and Effects of Cutting Parameters on Nanometric Cutting Process

Cited by 3 publications

References 10 publications

Nanometric cutting mechanism of cerium-lanthanum alloy

Nanometric cutting mechanism of cerium-lanthanum alloy

Effect of Surface Relaxation on Characteristics of Nanomachined Surface

Nanometric Cutting Mechanism of Cerium–Lanthanum Alloy

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