Printed electronics promises the realization of low-cost electronic systems on flexible substrates over large areas. In order to achieve this, high quality patterns need to be printed at high speeds. Gravure printing is a particularly promising technique that is both scalable and offers micron-scale resolution. Here, we review the tremendous progress that has recently been made to push gravure printing beyond its traditional limitations in the graphic arts. Rolls with far greater precision than traditional rolls and with sub-5 μm resolution can be fabricated utilizing techniques leveraging the precision of silicon microfabrication. Physical understanding of the sub-processes that constitute the gravure process is required to fully utilize the potential of gravure. We review the state-of-the-art of this understanding both for single cells and patterns of multiple cells to print high-resolution features as well as highlyuniform layers. Finally, we review recent progress on gravure printed transistors as an important technology driver. Fully high-speed printed transistors with sub-5 μm channel length and sub-5 V operation can be printed with gravure.

We discuss gravure and inkjet printing to produce sub-2 micron features at printing speeds of $1 m/s for high-performance fully-printed transistors on plastic over large areas.ABSTRACT | The realization of a high-speed printing technique with high resolution and pattern fidelity is critical to making printed electronics a viable technology for electronics manufacturing. The printing requirements of printed electronics are substantially different that those of graphic arts. To make printed electronics a reality, it is necessary to deliver high resolution, good reproducibility, excellent pattern fidelity, high process throughput, and compatibility with the requisite semiconductor, dielectric, and conductor inks. In this paper, we review the physics of pattern formation from pixelated primitives, such as those that exist during inkjet and gravure printing, and will show how control of drop merging and drying can be used to produce high-fidelity shapes, including lines, squares, and intersections. We additionally discuss the physical underpinnings of gravure printing and inkjet printing, and show how these techniques can be scaled to produce highfidelity highly scaled patterns, including sub-2 micron features at printing speeds of $1 m/s. Finally, in conjunction with high-performance materials, we describe our realization of high-performance fully printed transistors on plastic, offering high-switching speed, excellent process throughput, and good fidelity over large areas.

Highly scaled direct gravure is a promising printing technique for printed electronics due to its large throughput, high resolution, and simplicity. Gravure can print features in the single micron range at printing speeds of ∼1 m/s by using an optimized cell geometry and optimized printing conditions. The filling of the cells on the gravure cylinder is a critical process, since the amount of ink in the cells strongly impacts printed feature size and quality. Therefore, an understanding of cell filling is crucial to make highly scaled gravure printed electronics viable. In this work we report a novel experimental setup to investigate the filling process in real time, coupled with numerical simulations to gain insight into the experimental observations. By varying viscosity and filling speed, we ensure that the dimensionless capillary number is a good indicator of filling regime in real gravure printing. In addition, we also examine the effect of cell size on filling as this is important for increasing printing resolution. In the light of experimental and simulation results, we are able to rationalize the dominant failure in the filling process, i.e., air entrapment, which is caused by contact line pinning and interface deformation over the cell opening.

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