Chemical mechanical polishing (CMP) is considered as the paradigm shift that enabled optical photolithography to continue down to 0.12 m. Currently, the polishing physics is not well defined though it is known that the nature of the process makes particle removal after CMP difficult and necessary. It is important to understand the particle adhesion mechanisms resulting from the polishing process and the effect of the adhering force on particle removal in post-CMP cleaning processes. In this paper, strong particle adhesion is shown to be caused by chemical reactions (after initial hydrogen bonding) that take place in the presence of moisture and long aging time. In particle removal using brush cleaning, contact between the particle and the brush is essential to the removal of submicron particles. In noncontact mode, 0.1-m particle can hardly be removed when the brush is more than 1 maway from the particle. While in full contact mode, removal is possible for a 0.1-m particle at the investigated brush rotational speeds. The experimental data shows that high removal efficiency (low number of defects) is possible with a high brush pressure and a short cleaning time.

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The introduction of new substrate materials into the world of electronics has previously opened up new possibilities for novel applications and device designs. Here, the use of ion‐exchanged sodium aluminosilicate (NAS) glass is presented as a new type of substrate that is not only highly damage resistant, but also allows the fabrication of high performance organic electronic devices. The smoothness of the NAS glass surface enables favorable growth of the semiconductor layer, enabling high charge carrier mobilities for typical organic semiconductors, such as pentacene or C60, and a polymer semiconductor. No degradation of the device performance is observed as a result of ion migration into the active device region, and no compromise in substrate strength due to the processing conditions is made. This work suggests the possibility of new, highly durable electronic devices on glass in large area format.

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