Tungsten coatings were deposited on diamond particles by vacuum magnetron sputtering. The coated diamond particles were firstly heat treated at different temperatures, and diamond/copper (Cu) composites were fabricated by using a pressureless infiltration method afterwards. The influences of heat treatment on the microstructure and composition of tungsten based coating surface and diamond/copper composites were analyzed. Notable differences were found in the microstructure with heating temperatures. Moreover, the tungsten based coating surface contained large quantities of oxidized tungsten, and the phase composition of the coatings varied within the range of tungsten-W2C-WC as the heat treatment temperature increased. The fracture surface morphologies in the copper matrix composites reinforced with diamond particles with coatings were identically characterized with the presence of ductile fracture of matrix accompanied by dissociation of diamond particles from the matrix. The thermal conductivity (TC) and gas tightness behaviors of the diamond/copper composites were also explored. A maximum TC of 768 Wm -1 K -1 and a fine gas tightness of 2.5×10-10 Pam 3 /s were obtained with reinforcement of tungsten-coated diamond particles treated at 800 ℃. The value of the interface thermal resistance between copper and diamond particles was also estimated and specifically discussed.
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