Enhanced thermal conductivity in diamond/copper composites with tungsten coatings on diamond particles prepared by magnetron sputtering method

Jia, Jinhao; Bai, Shuxin; Xiong, Dangsheng; Xiao, Jiadong; Yan, Tingnan

doi:10.1016/j.matchemphys.2020.123422

Cited by 32 publications

(9 citation statements)

References 33 publications

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“…These coatings can be formed by physicochemical or mechanical methods. The diamond microcrystals are coated by treatment in molten salts, 3 magnetron sputtering 4 or chemical vapor deposition. 5 The coatings can also be deposited by heating diamond-metal powder mixtures in spark plasma sintering [6][7][8] or hot pressing facilities.…”

Section: Introductionmentioning

confidence: 99%

Selective deposition of silver particles on {111} or {100} diamond facets

Bokhonov,

Gavrilov,

Dudina

2024

CrystEngComm

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Section: Introductionmentioning

confidence: 99%

Selective deposition of silver particles on {111} or {100} diamond facets

Bokhonov,

Gavrilov,

Dudina

2024

CrystEngComm

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“…However, the effect of the W carbide on the interfacial thermal conductance ( G ) between Cu and diamond is still not clear. Much research has utilized analytical models such as Hasselman–Johnson (H-J) and differential effective medium (DEM) models to back-calculate the G between Cu and diamond in the W-modified Cu/diamond composites. − In addition, physical models such as the acoustic mismatch model (AMM) and the diffuse mismatch model (DMM) are constantly used to predict the G between Cu and diamond based on an ideal interface structure. As summarized in Figure , the back-calculated G values between Cu and diamond in the W-modified Cu/diamond composites do not show a direct connection with interlayer thickness and deviate from the prediction of the physical models.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Thermal Conductance between Cu and Diamond with Interconnected W−W₂C Interlayer

Zhang

Wang

et al. 2022

ACS Appl. Mater. Interfaces

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Manipulating the interfacial structure is vital to enhancing the interfacial thermal conductance (G) in Cu/diamond composites for promising thermal management applications. An interconnected interlayer is frequently observed in Cu/diamond composites; however, the G between Cu and diamond with an interconnected interlayer has not been addressed so far and thus is attracting extensive attention in the field. In this study, we designed three kinds of interlayers between a Cu film and a diamond substrate by magnetron sputtering coupled with heat treatment, including a W interlayer, an interconnected W–W2C interlayer, and a W2C interlayer, to comparatively elucidate the relationship between the interfacial structure and the interfacial thermal conductance. For the first time, we experimentally measured the G between Cu and diamond with an interconnected interlayer by a time-domain thermoreflectance technique. The Cu/W–W2C/diamond structure exhibits an intermediate G value of 25.8 MW/m2 K, higher than the 19.9 MW/m2 K value for the Cu/W2C/diamond structure and lower than the 29.4 MW/m2 K value for the Cu/W/diamond structure. The molecular dynamics simulations show that the G of the individual W2C/diamond interface is much higher than those of the individual Cu/diamond and W/diamond interfaces and W2C could reduce the vibrational mismatch between Cu and diamond; however, the G of the Cu/W2C/diamond structure is reduced by the lower thermal conductivity of W2C. This study provides insights into the relationship between the interconnected interfacial structure and the G between Cu and diamond and offers guidance for interface design to improve the thermal conductivity in Cu/diamond composites.

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“…between D and metal to improve the interface bonding state of composites. [11][12][13] Among them, TiC coating is considered to be the most effectiveness and potential to improve the interface bonding between D and metal on account of its extremely high hardness (37 GPa), high thermal stability, high modulus of elasticity (hundreds of GPa), and low coefficient of thermal expansion (7. 74×10 −6 K −1 ).…”

Section: Introductionmentioning

confidence: 99%

Effect of Chlorine Salts on TiC Coating Morphology and Bonding Strength of Diamond Surface in Molten Salt Reaction

Meng

Huang

2023

Cryst. Res. Technol.

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To obtain a high‐quality TiC coating on the diamond (D) surface and improve the interfacial properties of metal matrix composites, the optimized molten salt method is used to prepare TiC coatings on the D surface. The effects of NaCl, KCl, and NaCl–KCl molten salts on the uniformity, surface morphology, composition, and bonding ability of TiC coatings are investigated by scanning electron microscopy, energy‐dispersive X‐ray spectroscopy (EDS), X‐ray diffraction, and cold–hot cycling experiments. The results show that the boiling and pickling processes after the molten salt reaction can effectively remove the residual chloride salts and Ti powders to obtain clean TiC‐coated D. The TiC particles of the coating surfaces prepared by NaCl and KCl molten salts are finer and more uniform, which is due to their higher melting points and shorter real reaction time compared with NaCl–KCl mixed salts. The TiC coating prepared by KCl has the best bonding ability and can withstand 50 times as many cold–hot cycles due to its uniform fine deposition particles and appropriate thickness. And, during cold–hot cycles, it can be found that the TiC coating cracking and shedding occur primarily at the edges and corners of the D with internal thermal stress concentration.

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Enhanced thermal conductivity in diamond/copper composites with tungsten coatings on diamond particles prepared by magnetron sputtering method

Cited by 32 publications

References 33 publications

Selective deposition of silver particles on {111} or {100} diamond facets

Selective deposition of silver particles on {111} or {100} diamond facets

Interfacial Thermal Conductance between Cu and Diamond with Interconnected W−W₂C Interlayer

Effect of Chlorine Salts on TiC Coating Morphology and Bonding Strength of Diamond Surface in Molten Salt Reaction

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Enhanced thermal conductivity in diamond/copper composites with tungsten coatings on diamond particles prepared by magnetron sputtering method

Cited by 32 publications

References 33 publications

Selective deposition of silver particles on {111} or {100} diamond facets

Selective deposition of silver particles on {111} or {100} diamond facets

Interfacial Thermal Conductance between Cu and Diamond with Interconnected W−W2C Interlayer

Effect of Chlorine Salts on TiC Coating Morphology and Bonding Strength of Diamond Surface in Molten Salt Reaction

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Interfacial Thermal Conductance between Cu and Diamond with Interconnected W−W₂C Interlayer