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We propose an optical interconnect system for chip-to-chip communication using gold bond wires as a two wire waveguide. Here the loss of such a waveguide is determined for near-IR wavelengths, for different wire sizes and configurations, and show that we can achieve transmission loss coefficients less than 0.4 mm(-1) (1.7 dB/mm) making chip-to-chip optical communication possible using two-wire transmission lines made of standard gold bond wires. Such an optical waveguide scheme would greatly simplify inter-chip optical communication compared with existing waveguide concepts.

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Infrared scene projectors (IRSPs) are a critical laboratory tool for setup, calibration, and testing of infrared sensors. Infrared light emitting diode projectors are evolving to handle higher resolution, faster frame rates, and higher cooling power. New cryogenic packaging that can support these advanced features is needed. This paper describes a new cryogenic package design that enables higher resolutions and faster frame rates. The resulting modifications to the IRSP system hardware are described.