Die placement reference in die attach process is one of the critical aspects in measuring the actual die placement especially for the device that has a required measurement. This paper focused on the re-design on the layout of the substrate ball grid array (BGA) package with cross fiducials at the singulation lane which are located at the corner portions of the device. The cross fiducial would serve as a reference when measuring the actual placement of the Silicon die in the package. With this improvement, the technicians and operators could now easily identify the reference based on the mount and bonding diagram requirement.