In this paper, we propose inverting logic-in-memory (LIM) cells comprising silicon nanowire feedback field-effect transistors with steep switching and holding characteristics. The timing diagrams of the proposed inverting LIM cells under dynamic and static conditions are investigated via mixed-mode technology computer-aided design simulation to verify the performance. The inverting LIM cells have an operating speed of the order of nanoseconds, an ultra-high voltage gain, and a longer retention time than that of conventional dynamic random access memory. The disturbance characteristics of half-selected cells within an inverting LIM array confirm the appropriate functioning of the random access memory array.

The processing of large amounts of data requires a high energy efficiency and fast processing time for high-performance computing systems. However, conventional von Neumann computing systems have performance limitations because of bottlenecks in data movement between separated processing and memory hierarchy, which causes latency and high power consumption. To overcome this hindrance, logic-in-memory (LIM) has been proposed that performs both data processing and memory operations. Here, we present a NAND and NOR LIM composed of silicon nanowire feedback field-effect transistors, whose configuration resembles that of CMOS logic gate circuits. The LIM can perform memory operations to retain its output logic under zero-bias conditions as well as logic operations with a high processing speed of nanoseconds. The newly proposed dynamic voltage-transfer characteristics verify the operating principle of the LIM. This study demonstrates that the NAND and NOR LIM has promising potential to resolve power and processing speed issues.

Challenges in scaling dynamic random-access memory (DRAM) have become a crucial problem for implementing high-density and high-performance memory devices. Feedback field-effect transistors (FBFETs) have great potential to overcome the scaling challenges because of their one-transistor (1T) memory behaviors with a capacitorless structure. Although FBFETs have been studied as 1T memory devices, the reliability in an array must be evaluated. Cell reliability is closely related to device malfunction. Hence, in this study, we propose a 1T DRAM consisting of an FBFET with a p+–n–p–n+ silicon nanowire and investigate the memory operation and disturbance in a 3 × 3 array structure through mixed-mode simulations. The 1T DRAM exhibits a write speed of 2.5 ns, a sense margin of 90 μA/μm, and a retention time of approximately 1 s. Moreover, the energy consumption is 5.0 × 10−15 J/bit for the write ‘1’ operation and 0 J/bit for the hold operation. Furthermore, the 1T DRAM shows nondestructive read characteristics, reliable 3 × 3 array operation without any write disturbance, and feasibility in a massive array with an access time of a few nanoseconds.

In this study, we propose an inverter consisting of reconfigurable double-gated (DG) feedback field-effect transistors (FBFETs) and examine its logic and memory operations through a mixed-mode technology computer-aided design simulation. The DG FBFETs can be reconfigured to n- or p-channel modes, and these modes exhibit an on/off current ratio of ~ 1012 and a subthreshold swing (SS) of ~ 0.4 mV/dec. Our study suggests the solution to the output voltage loss, a common problem in FBFET-based inverters; the proposed inverter exhibits the same output logic voltage as the supply voltage in gigahertz frequencies by applying a reset operation between the logic operations. The inverter retains the output logic ‘1’ and ‘0’ states for ~ 21 s without the supply voltage. The proposed inverter demonstrates the promising potential for logic-in-memory application.

In this study, we examine the effect of interface trap states on the electrical characteristics of single-gated feedback field-effect transistors (FBFETs) using a commercially available computer-aided design simulation package. Interface trap states exist between the channels and the oxide layers, and these trap states act as acceptor-like trap states in regions of higher energy than the intrinsic Fermi energy (E i ) and as donor-like trap states in regions of lower energy than E i in the energy band. The density distribution peaks at E i + 0.28 eV for the acceptor-like trap states and at E i -0.28 eV for the donor-like trap states. The occupation mechanism of these trap states is analyzed by the density of the interface states and trapped charges, the energy band diagram, and the current-voltage curves. In n-channel (p-channel) FBFETs, the latch-up voltage varies by approximately 0.01 V as the acceptor-like (donor-like) trap states increase, whereas the effect of the donor-like (acceptor-like) trap states is negligible. Moreover, the FBFETs exhibit an operating speed of 4 ns and retention time of 900 s during a memory operation, despite the existence of the interface states.INDEX TERMS Positive feedback mechanism, memory, interface state, trap, FBFET.