Nanoindentation tests were performed on ultraprecision diamond-turned silicon wafers and the results were compared with those of pristine silicon wafers. Remarkable differences were found between the two kinds of test results in terms of load-displacement characteristics and indent topologies. The machining-induced amorphous layer was found to have significantly higher microplasticity and lower hardness than pristine silicon. When machining silicon in the ductile mode, we are in essence always machining amorphous silicon left behind by the preceding tool pass; thus, it is the amorphous phase that dominates the machining performance. This work indicated the feasibility of detecting the presence and the mechanical properties of the machining-induced amorphous layers by nanoindentation.
Single-crystal germanium is an excellent optical material in the infrared wavelength range. The development of germanium Fresnel lenses not only improves the optical imaging quality but also enables the miniaturization of optical systems. In the present work, we developed a ductile-mode micro grooving process for fabricating Fresnel lenses on germanium. We used a sharply pointed diamond tool to generate the micro Fresnel structures under three-axis ultraprecision numerical control. By adopting a small angle between the cutting edge and the tangent of the objective surface, this method enables the uniform thinning of the undeformed chip thickness to the nanometric range, and thus provides complete ductile regime machining of brittle materials. Under the present conditions, a Fresnel lens which has a form error of 0.5 µm and surface roughness of 20–50 nm Ry (peak-to-valley) was fabricated successfully during a single tool pass.
Single-crystal calcium fluoride (CaF2) is an excellent optical material in the infrared range and the ultraviolet range. It is an indispensable substrate material for the 193 and 157 nm wavelength laser optics for future large-scale semiconductor photolithography systems. Due to its delicate nature, for the most part the CaF2 elements have been fabricated using conventional pitch polishing combined with interferometry and local surface correction to form the desired flat, sphere or aspherical surface. In the present work, the feasibility of generating high quality optical surfaces on CaF2 by single-point diamond turning is examined. The development of this technology may provide the possibility of fabricating aspherical and diffractive optical components in an efficient way. The machining experiments described in this article were done on a high-stiffness, ultraprecision, numerically controlled diamond lathe with a sharply pointed single-crystal diamond tool. The scale of machining was varied from the micrometer level to the nanometer level. It was found that at the micrometer level, machining was significantly affected by the crystal orientation of the workpiece. The crystallographic anisotropy causes nonuniformity of the finished surface texture, microfracture topography and brittle–ductile transition boundary conditions. The results also indicate that by controlling the undeformed chip thickness below a critical value, namely, the minimum critical chip thickness (85 nm), a uniformly ductile-machined surface could be produced. Under the present experimental conditions, a surface with a maximum height (Ry) of 18.5 nm and arithmetical mean roughness (Ra) of 3.3 nm was obtained.
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