The AlGaN/GaN/AlGaN double heterostructure (DH) with high electron mobility of 1862 cm2/Vs at room temperature and 478 cm2/Vs at 573 K high temperature was obtained by a combination of optimization schemes considering scattering mechanisms. First, a composite buffer layer structure, including GaN and AlGaN layer, was used to improve the crystal quality of the AlGaN/GaN/AlGaN DH. Second, interface roughness scattering was reduced by increasing the channel thickness, thus the two-dimensional electron gas mobility was further improved. Moreover, an ultrathin AlN interlayer was inserted between the GaN channel layer and the AlGaN buffer layer to decrease the alloy disorder scattering. The Hall effect measurements showed that the DH had better transport characteristics at high temperatures, and an electron mobility of 478 cm2/Vs was achieved at 573 K, which is twice larger than that of the conventional single heterostructure (∼200 cm2/Vs at 573 K). Therefore, AlGaN/GaN/AlGaN DH is more suitable for the applications in high temperature electronic devices.

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We report on a growth of nearly lattice-matched InAlN/GaN heterostructures on 4H–SiC substrates by pulsed metal organic chemical vapor deposition, and an excellent device characteristic of high electron mobility transistors (HEMTs) fabricated on these InAlN/GaN heterostructures. The electron mobility is 1032 cm2/V s together with a high two-dimensional-electron-gas density of 1.59×1013 cm−2 for the In0.17Al0.83N/AlN heterostructures. HEMTs with gate dimensions of 0.5×50 μm2 and 3 μm source-drain distance exhibits a maximum drain current of 1 A/mm, a maximum extrinsic transconductance of 310 mS/mm, and current gain and maximum oscillation cutoff frequencies of 18 GHz and 39 GHz, respectively.

High quality, nearly lattice-matched InAlN/GaN/InAlN/GaN double-channel heterostructures were grown on sapphire by pulsed-metal-organic-chemical-vapor-deposition (PMOCVD). High electron mobility of 1414 cm 2 /Vs was achieved along with a two-dimensional-electron-gas density of 2.55 Â 10 13 cm À2. We attribute it to the high quality PMOCVD-grown InAlN barriers and, additionally, to the novel GaN layer growth between two InAlN barriers, which consists of a thin GaN spacer to prevent indium-redistribution and indium-cluster formation during the subsequent growth and a relatively thick GaN channel to enhance electron mobility. High-electron-mobility-transistors fabricated on these heterostructures with 0.8-lm-length gate exhibit a maximum drain current of 906 mA/mm and a transconductance of 186 mS/mm.

We present a detailed analysis of trap states in InAlN/AlN/GaN double-channel high electron mobility transistors grown by pulsed metal organic chemical vapor deposition. By frequency dependent conductance measurements, trap densities and time constants at both InAlN/AlN/GaN interfaces were determined. Two types of traps, with a high density of up to ∼1014 cm−2 eV−1, were observed existing at the higher InAlN/AlN/GaN interface. On the other hand, the density dramatically decreased to ∼1012 cm−2 eV−1 for traps located at lower InAlN/AlN/GaN interface on which a low-temperature grown GaN (LT-GaN) layer was deposited. Additionally, photo-assisted capacitance-voltage measurements were performed to estimate deep-level defects, yielding a low density of 1.79 × 1011 cm−2 acting as negative fixed charges at the LT-GaN and lower InAlN interface.