Highly stretchable and conductive composites have gained tremendous research interests due to the imperative demands in the fields of stretchable electronics and soft robotics. However, it is challenging to maintain the original performance of the composites under complex external deformations. Here, a one‐step dual‐material 3D printing technique is developed to rationally assemble liquid metal (LM) into an elastomer lattice. The 3D interconnected and deformable liquid conductive network is supported by a highly ordered and robust polydimethylsiloxane lattice skeleton, yielding the resultant composites high electrical conductivity (1.98 × 106 S m−1), stretchability (180%), and electromagnetic interference (EMI) shielding effectiveness (72 dB). Unlike those composites with dispersed fillers, the LM/elastomer lattice composites deliver negligible electromechanical coupling, showing a negative resistance change of only −2% at a large tensile strain of 100%. The composites also exhibit strain‐invariant EMI shielding performance in a strain range of 0–100%, and present exceptional stability over 1000 rigorous cycles of stretching and releasing. The applications of the composites in flexible display circuits, microwave shielding layer, and EMI shields in wireless power transmission systems are demonstrated. The current findings suggest an effective strategy for fabricating LM‐based composites with precisely controlled and unprecedented multi‐functionality.

In order to develop high-performance dielectric materials, poly(arylene ether nitrile)-based composites were fabricated by employing surface-hydroxylated calcium copper titanate (CCTO) particles. The results indicated that the surface hydroxylation of CCTO effectively improved the interfacial compatibility between inorganic fillers and the polymer matrix. The composites exhibit not only high glass transition temperatures and an excellent thermal stability, but also excellent flexibility and good mechanical properties, with a tensile strength over 60 MPa. Furthermore, the composites possess enhanced permittivity, relatively low loss tangent, good permittivity-frequency stability and dielectric-temperature stability under 160 °C. Therefore, it furnishes an effective path to acquire high-temperature-resistant dielectric materials for various engineering applications.

Poly(arylene ether nitrile)s (PAENs) play an important role in special engineering materials owing to their excellent mechanical strength and superior thermal stability. In this study, PAEN and carboxyl-functionalized poly(arylene ether nitrile) (CPAEN) were successfully synthesized and their thermal parameters were determined through thermogravimetric analysis and differential scanning calorimetry to investigate the thermal decomposition kinetics and thermal stability. The results indicate that both PAEN and CPAEN exhibited high glass transition temperature and initial decomposition temperature. Meanwhile, the effects of the side groups on the thermal stability and the decomposition kinetic parameters of PAEN and CPAEN under nitrogen were discussed systematically. The kinetic parameters of PAEN and CPAEN were determined using the Kissinger and Ozawa methods, respectively. It reveals that the activation energy ( E) values of PAEN obtained using the Kissinger and Ozawa methods were 192.45 and 206.63 kJ/mol, and the corresponding E values of CPAEN were 161.20 and 162.72 kJ/mol, respectively. The thermal decomposition mechanism of PAEN and CPAEN obtained from Coats–Redfern methods goes for F 3 and D 1 models, respectively.