Public repotmc burden for this collection of inlormat.on is estimated to average i hour per response, including the time for reviewing instructions, searching em.rg da.a sou.ce. oafher na anrJmaintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden es mate or any:othe-; a peao< th,s ^leSr of information, inciudir.o suggestions for reducing this burden, to Washington Headauarters Services Directorate for information Orations ana ?eP£». '< .5 Jefferson Dav&HiaVJvay Su>te 1204 Arlinotön VA 22202-4302. and to the Office of Management and Budget. Paperwork Reduction Project (0704-OieS). Washington. uC 2vS03.

Reflection x-ray pole figure analysis techniques were used to study the heteroepitaxial relationships of the cobalt germanide CoGe2 to GaAs(100). The alloy films were grown using the partially ionized beam deposition technique, in which low energy Ge+ ions are employed to alter the heteroepitaxial orientation of the CoGe2 deposits. The CoGe2[001](100)∥GaAs[100](001) orientation, which has the smallest lattice mismatch, was found to occur for depositions performed at a substrate temperature around 280 °C and with ∼1200 eV Ge+ ions. Lowering the substrate temperature or reducing the Ge+ ion energy leads to CoGe2(100) orientation domination with CoGe2[100](010)∥GaAs[100](001) and CoGe2[100](001)∥GaAs[100](001). Substrate temperature alone was seen to produce only the CoGe2(100) orientation. For CoGe2(001) films, additional energy was required from Ge+ ions in the evaporant stream.

2θ and pole figure x-ray analysis have been used to examine the crystal structure and orientation of Ag films deposited on GaAs(100) substrates cleaned by a variety of wet etches. Where epitaxy was observed, it was of the type Ag(110)/GaAs(100). The H3PO4/HCl sequential etch yielded the film with the highest degree of preferred orientation, with the H2SO4/HCl, NH4OH, and HF etches producing films of decreasing quality in the order named. The epitaxial quality is thought to scale with elemental As concentration on the GaAs(100) surface, and have an inverse relationship to the amount of surface oxides present before deposition.

In principle, the resistivity of bulk FCC cubic materials should not depend on the orientation due to the fact that the conductivity tensor is single valued. However, we show that this conclusion is not valid for thin films. Deposition of highly oriented Al, Ag, and Cu films on amorphous substrates using the partially ionized beam (PIB) technique exhibit a resistivity which is strongly correlated with the texture, i.e., the tighter the texture, the lower the film resistivity. We model the film as an array of grains whose grain boundaries can be considered as delta function potentials for electron scattering and the strength of the potentials can be calculated from the measured resistivity of the films. On the other hand, the fiber texture distribution of the the films is obtained from X-ray pole figure measurements, and Monte-Carlo simulations are then performed using this data to determine the average dislocation density at the grain boundaries due to the grain to grain crystallographic mismatch. We show that the transmittance coefficient for electron scattering, and therefore the film resistivity, is a monotonically increasing function of the average dislocation density. We therefore conclude that the structure of grain boundaries in a thin film provides the necessary mechanism by which the resistivity of an FCC cubic metal can depend on the texture.

No abstract