This paper studies the influence of surface residual stress on the fracture of the double cantilever beam (DCB) specimens. The closed-form solutions of the energy release rate and the stress intensity factor are derived by using Timoshenko beam theory. Results show that positive residual surface stress and the root effect of the DCB enhance the energy release rate and the stress intensity factor. The root effect cannot be neglected if the thickness of the beam is at the nanoscale (e.g., less than 100 nm), even though the ratio of beam length to thickness is larger.

End notched flexure (ENF) experiment using three-point bending beam specimen is a very convenient test configuration to evaluate the mode-II fracture toughness of composites. High-temperature superconductor (HTS) tapes are multi-layered composite that have been widely used in magnets and cables. HTS tapes are manufactured at room temperature ([Formula: see text][Formula: see text]300 K) but are used in the liquid-nitrogen temperature (77 K) environment. The large temperature change leads to large shear stress which may cause delamination of HTS tapes. In this paper, a closed-form expression of energy release rate (and therefore the stress intensity factor) for mode-II fracture of HTS tapes with thermal effect is developed based on the end notched flexure specimen. Results show that HTS tapes in working condition are prone to delaminating. Increasing the thickness of Hastelloy layer can reduce the energy release rate of mode-II cracking thus increase the interface strength. In the design of HTS tapes, the silver and copper layers are used to enhance the stretch of the HTS tapes. While silver and copper layers will increase the energy release rate for mode-II crack. This fact indicates that thicker silver and copper layers are not always good from the fracture mechanics point of view. The results of thermomechanical model and fracture criterion model of this research are useful for determining mode-II fracture toughness of superconducting composites for high-temperature applications.