We have successfully demonstrated chemical vapor deposition of a silica film in which some of oxygen atoms of the pure silica network are replaced to methylene (-CH 2 -) groups. The as-deposited film was thermally unstable owing to the unwanted decomposition reaction of the methylene group with the dense H 2 O in the film. It was found that the film could be dehydrated without decomposition of the methylene group by low temperature annealing in a XeF 2 ambient. The dehydrated film showed not only good insulating and low-k characteristics ͑resistivity of 10 15 ⍀ cm, breakdown field of 3.3 MV/cm, and k of 2.8͒, but also good thermal properties, such as good thermal stability and high thermal conductivity.
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