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Wire solders usually contain flux and it can remove an oxide film on the metal surface chemically. The influence of the flux is important in soldering. Recently, the new packaging technology was developed, it is called Sleeve soldering. It is a kind of through-hole technology. Sleeve soldering can prevent to spatter flux contained in the wire solder and solder balls. It is not known behaviors of melting wire solder in the sleeve. The purpose of this study is to investigate the behaviors and to obtain proper conditions for Sleeve soldering. The proper condition consists of two factors. One is temperature of the sleeve. The other is amounts of wire solder. The behavior of melting wire solder in the sleeve is observed using a high speed camera. This paper describes observation results using a high-speed camera and influences of the flux in Sleeve soldering.