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Wire solders usually contain flux and it can remove an oxide film on the metal surface chemically. The influence of the flux is important in soldering. Recently, the new packaging technology was developed, it is called Sleeve soldering. It is a kind of through-hole technology. Sleeve soldering can prevent to spatter flux contained in the wire solder and solder balls. It is not known behaviors of melting wire solder in the sleeve. The purpose of this study is to investigate the behaviors and to obtain proper conditions for Sleeve soldering. The proper condition consists of two factors. One is temperature of the sleeve. The other is amounts of wire solder. The behavior of melting wire solder in the sleeve is observed using a high speed camera. This paper describes observation results using a high-speed camera and influences of the flux in Sleeve soldering.

Automatic soldering technic called Sleeve soldering has been developed recently. In the technic, a ceramic tube has been used instead of a soldering iron. It is called Sleeve. Fixed amount of solder is loaded into this Sleeve. The melted solder is poured from tip of the Sleeve to glue electronic parts into electronic boards. At present Sleeve soldering has been produced and introduced. However condition of soldering failure and concept of process design are not clear due to a few data of melting behavior and solidification. In this research we intended to express these standards by comparing numerical analysis and experiment. Moreover we explain about the establishment of numerical analysis method in this paper. Result in the behavior using the solder model has been similar to actual phenomenon in this simulation. Besides, we have confirmed that the fillet and back fillet was arisen on both sides of the electronic board.