Abstract. Sn-3mass%Ag-0.5mass%Cu lead-free solder causes strong erosion of Fe plating, which is used in hand soldering. In order to improve the durability of the soldering iron tip, we tried Fe-MWCNT (Multi-walled Carbon Nanotube) composite plating on the tip. Microstructures and the erosion resistance of the Fe-MWCNT composite plating under heating were examined. On the basis of the SEM/EDS analysis, it was confirmed that there were MWCNTs in the Fe-MWCNT composite plating. Even when heated to 673 K, MWCNTs were found to be present in the plating film under a stable condition. It was shown that the performance of erosion resistance for lead-free solders under high temperature (673 K) is improved due to the MWCNT addition to the Fe plating.

The use of Sn-3mass%Ag-0.5mass%Cu lead-free solder (SAC305) has become common. Since SAC305 has a higher content of tin than conventional tin–lead eutectic solder, erosion of the Fe plating layer used in the solder iron tip and the point soldering machine nozzle frequently occurs. In this study, to prolong the life of the Fe plating layer, the applicability of composite plating in which a carbon-type filler is compounded with Fe was studied. Graphite and a multi-walled carbon nanotube (MWCNT) were used as filler materials in the composite plating layer. For both Fe-graphite and Fe-MWCNT composite plating layers, solderability testing and erosion-resistance testing were carried out. In the solderability test, although the spread rates of SAC305 to both Fe-graphite and Fe-MWCNT plating layers slightly decreased compared to the Fe plating layer, SAC305 solder was not repelled against both plating layers. In the erosion-resistance test, the Fe-MWCNT composite plating layer performed the best with the least erosion depth. The erosion depth of the Fe-graphite composite plating layer and the Fe plating layer were 10 and 100 times larger than that of the Fe-MWCNT composite plating layer, respectively. It was confirmed that the diffusion of Fe into molten SAC305 could be greatly reduced due to the composing carbon filler in Fe.

In accordance with the EU RoHS Directive, the use of Sn3 mass%Ag0.5 mass%Cu lead-free solder (SAC305) has become the standard in the manufacturing of electronics. Since SAC305 contains more tin than the conventional tin-lead eutectic solder, erosion of the Fe plating frequently occurs on a hand soldering iron tip and a point soldering machine nozzle. In this study, to extend the life of the Fe plating layer, we investigated the applicability of a composite plating in which Fe is combined with the boron nitride (BN) compounds. We used BN particles as the bulk material, and boron nitride nanotubes (BNNT) as a nanomaterial, to fabricate the regarded composite materials. A solderability test and an erosion resistance test were conducted on the composite plating layer, made of both Fe-BN particles and Fe-BNNTs composites. In the solderability test, the spreading factor of SAC305 on the Fe-BN particle and on the Fe-BNNT composite platings were about the same as, or a little decreased compared to, that of the bare Fe plating. The SAC305 solder was not repelled by either composite plating. In the erosion resistance test, the Fe-BNNT composite plating performed the best, and had the lowest erosion depth. The erosion depths of the Fe-BN particle composite plating and the Fe plating ranged from about 6 to 24 times greater, respectively, than those of the Fe-BNNT composite plating layer, confirming that, in a nanomaterial BNNT-base, composite diffusion of Fe into SAC 305 can be suppressed.