Indium is a commonly used metal for sealing, bonding, and soldering due to its good malleability and ductility even at cryogenic temperatures. The effects of hydrogen radical treatment on indium surface oxide removal were evaluated by the spreading ratio test of indium balls (diameter, 300 µm; purity, 99.99%). It was found that hydrogen radical treatment longer than 20 s at temperatures higher than 170 °C results in successful surface oxide removal. X-ray photoelectron spectroscopy analysis was carried out to study the re-oxidation behavior after treatment, and it was found that hydrogen radical treatment slows down the re-oxidation of indium compared with surface oxide removal realized by physical bombardment with an argon fast atom beam.
It is known that good surface roughness can be achieved by ECM with a high current density. However, when the tool electrode moves across the surface of the workpiece the low current density area which follows the high current density area roughens the surface. Attempts to suppress the effect of the low current density area by utilizing pulse currents to obtain a glossy surface were made. This paper reports the experimental results of ECM with a moving wire electrode on an EDMed surface to investigate the effect of various conditions on the machined surface.
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