Ni 80 Fe 20 /Cu and Co/Cu multilayers with Cu layer thicknesses corresponding to the first and second antiferromagnetic (afm) coupling maximum were prepared by dc-magnetron sputtering and investigated with respect to their annealing behavior. The as-deposited films showed giant magnetoresistance (GMR) up to 50% at room temperature. The annealing behavior of the multilayers belonging to the same Cu layer thickness is found to be very similar up to 200 °C. For both kind of multilayers with a Cu layer thickness of about 1 nm (first afm maximum) the GMR degrades upon annealing in excess of 140 °C. However, with a Cu layer thickness of about 2 nm (second afm maximum) the multilayers are stable with respect to their GMR properties even after prolonged exposure up to 200 °C. Moreover, in some cases even an improvement of GMR upon the annealing procedure may be found.

The quality assurance for the production of optical components for Extreme Ultra Violet Lithography (EUVL) strongly requires at-wavelength metrology. Presently, at-wavelength characterizations of mirrors and masks are done using the synchrotron radiation of electron storage rings, e.g. BESSY II. For the production process of EUV optics, however, the immediate access to metrology tools is necessary and the availability of laboratory devices is mandatory. Within the last few years a stand alone laboratory EUV reflectometer for large samples has been developed. It consists of a laser produced plasma (LPP) radiation source, a monochromat or and a large goniometer system. The manipulation system of the reflectometer can handle samples with diameters of up to 500 mm, thicknesses of up to 200 mm and weights of up to 30 kg. The wavelength can be varied from 10 nm to 16 nm. The spot size on the sample surface is about 2 mm. The angle of incidence can be varied from 3° to 60°. In this paper, we describe the laboratory reflectometer in detail and discuss the achieved performance. First measurements of 4" mirrors are presented and discussed in comparison to the results obtained at the PTB soft X-ray radiometry beamline at BESSY II

No abstract

The evolution of electrical resistance, stress, and microstructure during annealing has been studied on 100 nm NiFe(20 wt %)/200 nm Cu/100 nm NiFe trilayers. Irreversible resistance changes and the concentration-depth profiles show that, at and above 200 °C, diffusion of Ni into Cu as well as of Cu into NiFe occurs. The interdiffusion is held for an important failure mechanism of Cu/NiFe-based magnetoelectronic system at elevated temperatures.

-Copper cavities with a thin niobium film -as used in the large electron positron collider LEP -would be also attractive for future linear colliders, provided the decrease of the Q-value with the accelerating gradient could be reduced. We aim at extracting the important parameters that govern this decrease. The dependence on the RF frequency is studied by exciting 500 MHz and 1500 MHz cavities in different modes. In addition we combined RF measurements for two 1500 MHz cavities of different RF performance with microscopic tests (AFM, TEM) on samples cut out of the same cavities. Their micro-structural characterization in plan-view allows to extract the grain size and the defect densities.