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The aim of the present work was to study the passive film stability and pitting corrosion behavior of the AISI 409 stainless steel. The electrochemical tests were carried out in 0.1 M NaCl solution at room temperature. The general electrochemical behavior was assessed using electrochemical impedance spectroscopy (EIS) measurements whereas the semiconducting properties of the passive film were evaluated by the Mott-Schottky approach. Pitting corrosion was investigated using potentiodynamic and potentiostatic polarization tests. Surface morphology was examined using confocal laser scanning microscopy and scanning electron microscopy (SEM). Energy dispersive X-ray spectroscopy (EDS) analyses were carried out to identify the composition of precipitates that could act as preferential sites for the onset of pitting corrosion. The results showed that the passive film presents n-type semiconductive behavior. Grain boundaries played an important role as pitting initiation sites for the AISI 409 stainless steel.

In this work, scanning electrochemical microscopy (SECM) measurements were employed to characterize the electrochemical activities on polished and as-received surfaces of the 2098-T351 aluminum alloy (AA2098-T351). The effects of the near surface deformed layer (NSDL) and its removal by polishing on the electrochemical activities of the alloy surface were evaluated and compared by the use of different modes of SECM. Confocal laser scanning microscopy (CLSM) and scanning electron microscopy (SEM) were also employed to characterize the morphology of the surfaces. The surface chemistry was analyzed by X-ray photoelectron spectroscopy (XPS). The surface generation/tip collection (SG/TC) and competition modes of the SECM were used to study hydrogen gas (H 2 ) evolution and oxygen reduction reactions, respectively. H 2 evolution and oxygen reduction were more pronounced on the polished surfaces. The feedback mode of SECM was adopted to characterize the electrochemical activity of the polished surface that was previously corroded by immersion in a chloride-containing solution, in order to investigate the influence of the products formed on the active/passive domains. The precorroded surface and as-received surfaces revealed lower electrochemical activities compared with the polished surface showing that either the NSDL or corrosion products largely decreased the local electrochemical activities at the AA2098-T351 surfaces. KEYWORDS aluminum alloy, localized corrosion, SECM, surface finishing condition 1 | INTRODUCTION Aluminum alloys are commonly used in automotive and aerospace applications because of their good mechanical properties and low density.There is an increase in the demand for materials that exhibit a combination of high specific strength and corrosion resistance for industrial applications. 1,2 In order to meet this demand, new generation aluminum-lithium (Al-Li) alloys with properties superior to those of the conventionally used Al alloys are being developed for use as structural components in aircraft. [3][4][5] The AA2098 Al-Cu-Li alloy was developed as a substitute for AA2024 and AA2219. The AA2098 alloy presents low density, high mechanical resistance, high toughness, high-temperature resistance, weldability, and good response to natural aging. These properties are achieved by a carefully tailoring its chemical composition, whose main alloying elements are Cu, Li, Mg, Ag, and Zr. The addition of lithium improves the mechanical properties of the Al alloy in that for every 1 wt% of Li added to aluminum, the density of the alloy is reduced by 3%, and the Young's modulus is increased by almost 6%. 5-7 However, this element increases the susceptibility of the alloy to localized

The galvanic coupling effects and the local electrochemical activity developed along the welded zones in FSWelded 2098-T351 Al-Cu-Li alloy have been investigated using localized electrochemical methods supported by surface analytical characterizations. The investigation was carried out in the coupled welding joint/heat affected zones (WJ/HAZ) for both the retreating (RS) and the advancing (AS) sides. The correlation between surface chemistry, microstructural features and electrochemical activity of these welded zones has been studied. The results showed the development of galvanic interactions within and between the WJ and the HAZ regions that were visualized using the Scanning vibrating electrode technique (SVET) and scanning electrochemical microscopy (SECM). SVET analyses showed that the HAZ was more susceptible to the development of anodic sites compared to WJ. SECM in amperometric operation mode showed that the WJ coupled to HAZ presented higher oxygen consumption and greater cathodic activity compared to HAZ. Furthermore, SECM in the potentiometric operation mode showed alkalization on the WJ and increased acidity on the HAZ, mainly at severe localized corrosion (SLC) sites. Based on SVET and SECM results in combination surface analysis, it is proposed that the micro-galvanic cells formed within these welded zones are due to the presence of secondary phases in the 2098-T351 alloy and their interactions with the adjacent matrix.