Epitaxial Sc xAl1− xN thin films of ∼100 nm thickness grown on metal polar GaN substrates are found to exhibit significantly enhanced relative dielectric permittivity (εr) values relative to AlN. εr values of ∼17–21 for Sc mole fractions of 17%–25% ( x = 0.17–0.25) measured electrically by capacitance–voltage measurements indicate that Sc xAl1− xN has the largest relative dielectric permittivity of any existing nitride material. Since epitaxial Sc xAl1− xN layers deposited on GaN also exhibit large polarization discontinuity, the heterojunction can exploit the in situ high-K dielectric property to extend transistor operation for power electronics and high-speed microwave applications.

Interband Zener tunneling of electrons has been recently used in III-nitride semiconductor based light emitters to efficiently inject holes into p-cladding layers. Zener tunneling probabilities can be significantly enhanced if crystal symmetry-induced internal polarization fields assist the dopant-induced built-in electric fields of tunnel junctions because of the large reduction of the tunneling distance. In a metal-polar buried tunnel junction geometry, such electric field alignment needs an AlN interlayer at the tunnel junction. Because AlN is a larger bandgap semiconductor than GaN, it is not clear a priori if the net tunneling probability is reduced or enhanced compared to a homojunction. By combining theoretical modeling with experimental blue light emitting diodes, we find that the large tunneling enhancement due to the polarization field and band realignment overcome the reduction in tunneling due to the larger bandgap of AlN. Compared to a homojunction tunnel-junction, the inclusion of AlN in the tunnel junction is found to lower the turn-on and operating voltages and increase the wall-plug efficiency. This proves that polarization-induced AlN tunnel junctions are superior to homojunctions at low injection currents, resulting in higher optical emission intensity and superior uniformity.

Single-photon defect emitters (SPEs), especially those with magnetically and optically addressable spin states, in technologically mature wide bandgap semiconductors are attractive for realizing integrated platforms for quantum applications. Broadening of the zero phonon line (ZPL) caused by dephasing in solid state SPEs limits the indistinguishability of the emitted photons. Dephasing also limits the use of defect states in quantum information processing, sensing, and metrology. In most defect emitters, such as those in SiC and diamond, interaction with low-energy acoustic phonons determines the temperature dependence of the dephasing rate and the resulting broadening of the ZPL with the temperature obeys a power law. GaN hosts bright and stable single-photon emitters in the 600–700 nm wavelength range with strong ZPLs even at room temperature. In this work, we study the temperature dependence of the ZPL spectra of GaN SPEs integrated with solid immersion lenses with the goal of understanding the relevant dephasing mechanisms. At temperatures below ~ 50 K, the ZPL lineshape is found to be Gaussian and the ZPL linewidth is temperature independent and dominated by spectral diffusion. Above ~ 50 K, the linewidth increases monotonically with the temperature and the lineshape evolves into a Lorentzian. Quite remarkably, the temperature dependence of the linewidth does not follow a power law. We propose a model in which dephasing caused by absorption/emission of optical phonons in an elastic Raman process determines the temperature dependence of the lineshape and the linewidth. Our model explains the temperature dependence of the ZPL linewidth and lineshape in the entire 10–270 K temperature range explored in this work. The ~ 19 meV optical phonon energy extracted by fitting the model to the data matches remarkably well the ~ 18 meV zone center energy of the lowest optical phonon band ($$E_{2}(low)$$ E 2 ( l o w ) ) in GaN. Our work sheds light on the mechanisms responsible for linewidth broadening in GaN SPEs. Since a low energy optical phonon band ($$E_{2}(low)$$ E 2 ( l o w ) ) is a feature of most group III–V nitrides with a wurtzite crystal structure, including hBN and AlN, we expect our proposed mechanism to play an important role in defect emitters in these materials as well.

This report classifies emission inhomogeneities that manifest in InGaN quantum well blue light-emitting diodes grown by plasma-assisted molecular beam epitaxy on free-standing GaN substrates. By a combination of spatially resolved electroluminescence and cathodoluminescence measurements, atomic force microscopy, scanning electron microscopy and hot wet potassium hydroxide etching, the identified inhomogeneities are found to fall in four categories. Labeled here as type I through IV, they are distinguishable by their size, density, energy, intensity, radiative and electronic characteristics and chemical etch pits which correlates them with dislocations. Type I exhibits a blueshift of about 120 meV for the InGaN quantum well emission attributed to a perturbation of the active region, which is related to indium droplets that form on the surface in the metal-rich InGaN growth condition. Specifically, we attribute the blueshift to a decreased growth rate of and indium incorporation in the InGaN quantum wells underneath the droplet which is postulated to be the result of reduced incorporated N species due to increased N2 formation. The location of droplets are correlated with mixed type dislocations for type I defects. Types II through IV are due to screw dislocations, edge dislocations, and dislocation bunching, respectively, and form dark spots due to leakage current and nonradiative recombination.

A recent thrust toward efficient modulated light emitters for use in Li-Fi communications has sparked renewed interest in visible III-N InGaN light-emitting diodes (LEDs). With their high external quantum efficiencies, blue InGaN LEDs are ideal components for such devices. We report a method for achieving voltage-controlled gate-modulated light emission using monolithic integration of fin- and nanowire-n–i–n vertical FETs with bottom-tunnel junction planar blue InGaN LEDs. This method takes advantage of the improved performance of bottom-tunnel junction LEDs over their top-tunnel junction counterparts, while allowing for strong gate control on a low-cross-sectional area fin or wire without sacrificing the LED active area as in lateral integration designs. Electrical modulation of five orders and an order of magnitude of optical modulation are achieved in the device.