We report on the performance of AlGaN-based deep ultraviolet light-emitting diodes (UV-LEDs) emitting at 265 nm grown on stripe-patterned high-temperature annealed (HTA) epitaxially laterally overgrown (ELO) aluminium nitride (AlN)/sapphire templates. For this purpose, the structural and electro-optical properties of ultraviolet-c light-emitting diodes (UVC-LEDs) on as-grown and on HTA planar AlN/sapphire as well as ELO AlN/sapphire with and without HTA are investigated and compared. Cathodoluminescence measurements reveal dark spot densities of 3.5 × 10 9    cm − 2 , 1.1 × 10 9    cm − 2 , 1.4 × 10 9    cm − 2 , and 0.9 × 10 9    cm − 2 in multiple quantum well samples on as-grown planar AlN/sapphire, HTA planar AlN/sapphire, ELO AlN/sapphire, and HTA ELO AlN/sapphire, respectively, and are consistent with the threading dislocation densities determined by transmission electron microscopy (TEM) and high-resolution X-ray diffraction rocking curve. The UVC-LED performance improves with the reduction of the threading dislocation densities (TDDs). The output powers (measured on-wafer in cw operation at 20 mA) of the UV-LEDs emitting at 265 nm were 0.03 mW (planar AlN/sapphire), 0.8 mW (planar HTA AlN/sapphire), 0.9 mW (ELO AlN/sapphire), and 1.1 mW (HTA ELO AlN/sapphire), respectively. Furthermore, Monte Carlo ray-tracing simulations showed a 15% increase in light-extraction efficiency due to the voids formed in the ELO process. These results demonstrate that HTA ELO AlN/sapphire templates provide a viable approach to increase the efficiency of UV-LEDs, improving both the internal quantum efficiency and the light-extraction efficiency.

Herein, the scope is to provide an overview on the current status of AlN/sapphire templates for ultraviolet B (UVB) and ultraviolet C (UVC) light‐emitting diodes (LEDs) with focus on the work done previously. Furthermore, approaches to improve the properties of such AlN/sapphire templates by the combination of high‐temperature annealing (HTA) and patterned AlN/sapphire interfaces are discussed. While the beneficial effect of HTA is demonstrated for UVC LEDs, the growth of relaxed AlGaN buffer layers on HTA AlN is a challenge. To achieve relaxed AlGaN with a low dislocation density, the applicability of HTA for AlGaN is investigated.

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Recovery of epitaxial AlN films on sapphire at high temperatures is now an established process to produce pseudo-substrates with high crystalline perfection, which can be used to grow epitaxial structures for UV-light-emitting devices. To elucidate the elementary mechanisms taking place during the thermal treatment of MOVPE-grown films, we studied as-grown and annealed samples combining transmission electron microscopy techniques and secondary ion mass spectrometry (SIMS). By using SIMS, we find a temperature-dependent increase in the overall oxygen content of the films, which cannot be explained quantitatively with either simple bulk or pure pipe-diffusion from the sapphire substrate. Instead, we propose a lateral outdiffusion from the dislocation cores to explain qualitatively and quantitatively the presence of observed oxygen concentration plateaus. Based on the formation enthalpy of various atomic defects and complexes found in literature, we conclude that the di-oxygen/aluminum vacancy complex (VAl–2ON) is the dominant point defect controlling the annealing process. The formation of this defect at high temperatures promotes a dislocation core climb process, which causes the annihilation/fusion of the threading dislocation segments.

Strain relaxation mechanisms in AlGaN based light emitting diodes emitting in the ultraviolet B spectral range (UVB‐LEDs) grown on different AlN/sapphire templates are analyzed by combining in situ reflectivity and curvature data with transmission electron microscopy. In particular, the impact of dislocation density, surface morphology, and lattice constant of the AlN/sapphire templates is studied. For nonannealed AlN/templates with threading dislocation densities (TDDs) of 4 × 109 and 3 × 109 cm−2 and different surface morphologies strain relaxation takes place mostly by conventional ways, such as inclination of threading dislocation lines and formation of horizontal dislocation bands. In contrast, a TDD reduction down to 1 × 109 cm−2 as well as a reduction of the lattice constant of high temperature annealed AlN template leads to drastic changes in the structure of subsequently grown AlGaN layers, e.g., to transformation to helical dislocations and enhanced surface enlargement by formation of macrofacets. For the growth of strongly compressively strained AlGaN layers for UVB‐LEDs the relaxation mechanism is strongly influenced by the absolute values of TDD and the lattice constant of the AlN templates and is less influenced by their surface morphology.