Carbon/carbon–copper(C/C–Cu) composites are fabricated by infiltration of Cu into Mo2C interlayer‐modified carbon/carbon(C/C) preforms. Effect of graphitization on the microstructure and properties of the C/C–Cu composites is studied. The C/C–Cu composite with graphitization shows lower electrical resistivity, thermal expansion coefficient, friction coefficient, and an obvious higher thermal conductivity due to higher graphitization degree. However, it presents lower flexural strength, impact toughness, and higher wear rate. The composite with graphitization exhibits mainly abrasive wear while that without graphitization exhibits mainly adhesion wear, and both composites show oxidation wear.

A carbon/carbon-ZrC(C/C-ZrC) composite was fabricated by reactive infiltration of a Zr-40 wt% Cu powder mixture. The C/C-ZrC composite was composed of C, ZrC, and residual Cu. Continuous ZrC layers around the pyrolytic carbon and isolated ZrC particles dispersed in Cu were detected. Linear ablation rate of the composite increased with the increase of ablation time. Ablation surface of the composite was mainly composed of monoclinic ZrO 2 , while the quantity of Cu and Cu 2 O decreased with the increase of ablation time. The better ablation resistance of the C/C-ZrC composite was mainly attributed to the protective ZrO 2 layer and the cooling effect of Cu.

Carbon/carbon-copper(C/C-Cu) composites were fabricated by pressure-less infiltration of Cu into carbon/carbon (C/C) preforms modified with Mo 2 C interlayer by a molten salt method. Cu filled the pores inside the Mo 2 C-modified preforms fully, and retained an interconnected net-like distribution in the C/C-Cu composites. The electrical resistivity and flexural strength increased, whereas impact toughness decreased with the increase of preform density. Fiber pull-out and crack propagation along the interface contributed to the pseudo-plastic behavior of the composites. The tribological performance was improved with the increase of preform density due to the better lubrication of transfer films.