Hexagonal boron nitride micro particles functionalized by γ-MPS, were used to fabricate PI/BN composites. The thermal conductivity of the composites with 40 wt% m-BN content was increased to 0.748 W m−1 K−1, 4.5 times higher than that of the pure PI.

A novel poly(cyclotriphosphazene-co-bisphenol A)-coated boron nitride (PCB-BN) was synthesized by in situ polymerization on the surface of BN. The epoxy/PCB-BN composites showed the enhanced thermal conductivity with the improved flame retardance.

Polyacrylic pressure-sensitive adhesives based on butyl acrylate, 2-hydroxyethyl acrylate, and acrylic acid were prepared by a bulk polymerization process triggered by a radical photoinitiator under UV irradiation and UV-crosslinking.

A biology-inspired approach was utilized to functionalize hexagonal boron nitride (h-BN), to enhance the interfacial interactions in acrylonitrile-butadiene-styrene copolymer/boron nitride (ABS/BN) composites. The poly (dopamine), poly (DOPA) layer, was formed on the surface of BN platelets via spontaneously oxidative self-polymerization of DOPA in aqueous solution. The modified BN (named as mBN) coated with poly (DOPA) was mixed with ABS resin by melting.The strong interfacial interactions via π-π stacking plus Van der Waals, both derived from by poly (DOPA), significantly promoted not only the homogeneous dispersion of h-BN in the matrix, but also the effective interfacial stress transfer, leading to improve the impact strength of ABS/mBN even at slight mBN loadings. A high thermal conductivity of 0.501 W/(m·K) was obtained at 20 wt% mBN content, reaching 2.63 times of the value for pure ABS (0.176 W/(m·K)).Meanwhile, the ABS/mBN composites also exhibited an excellent electrical insulation property, which can be expected to be applied in the fields of thermal management and electrical enclosure. Due to superior electrical insulation, good processability, light weight, and low cost, polymers have been widely used in electrical and electronic fields.1 However, the thermal conductivity of typical polymer is far below the demand for heat dissipation. In recent years, some non-covalent methods are explored, which are usually applying physical interaction between the matrix and the fillers such as Van der Waals attractions, electrostatic interactions, π-effects, and hydrogen bonding. [38][39][40][41][42] Compared with covalent methods, non-covalent modification is much more convenient, and it can keep the intrinsic properties of BN away from disruption of extended π-conjugation systems.In this study, BN platelets were functionalized by a non-covalent method with dopamine (DOPA) as a modifier. The poly(DOPA) layer indeed played an important role in enhancing the interfacial interactions between the fillers and the matrix. The thermal conductivity and other properties of ABS/BN composites were discussed. | Surface modification of BNThe poly(DOPA) coated BN (donated as mBN) was prepared in a typical route as follows: 2-g BN was mechanically stirred and sonicated for 2 hours in a 200-mL flask containing a phosphate (Na 2 HPO 4 + KH 2 PO 4 ) buffer solution (PBS, pH 8.5). The pH value was determined by pH meter (PHS-25, Shanghai Scientific Instrument Co., Ltd., China). Then, 0.2-g DOPA was charged into the resulting mixture, followed by vigorously stirring at 28°C for the fixed periods (t = 1, 2, 5, 10, 20 hours) to ensure self-polymerization on the surface of BN platelets. Subsequently, the suspension was filtered through a 0.45-μm membrane and washed several times with deionized water until the filtrate became colorless and neutral to get the modified BN platelets (mBN).The final product was dried in a vacuum oven at 40°C for 24 hours. Figure 1 describes the possible mechanism referred to in some literatures. 43,46 Th...

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