No abstract

Currently, inkjet printing conductive films have attracted more and more attention in the field of electronic device. Here, the inkjet-printed silver thin films based on nanoparticles (NP) ink and metal-organic decomposition (MOD) ink were cured by the UV curing method and heat curing method. We not only compared the electrical resistivity and adhesion strength of two types of silver films, but also studied the effect of different curing methods on silver films. The silver films based on NP ink had good adhesion strength with a lowest electrical resistivity of 3.7 × 10−8 Ω·m. However, the silver film based on MOD ink had terrible adhesion strength with a lowest electrical resistivity of 2 × 10−8 Ω·m. Furthermore, we found a simple way to improve the terrible adhesion strength of silver films based on MOD ink and tried to figure out the mechanisms. This work offers a further understanding of the different performances of two types of silver films with different curing methods.

Inkjet printing has been proved to be a powerful tool in the cost-effective ambient deposition of functional materials for the fabrication of electronic devices in the past decades. However, restricted by equipment and inks, the feature size of printed dots or lines with conventional inkjet printing is usually limited to several tens of micrometers, which could not fit the requirements for the fabrication of large-area, high-resolution microscale, even nanoscale, structures. Therefore, various technical means were developed for breaking the equipment limits. Here, we report a strategy for realizing ultrashort channels and homogeneous microstructures arrays by a conventional piezoelectric inkjet printing technique without any additional pre-mask process on the substrate. This strategy extends application of piezoelectric inkjet printing technique to biological and technological areas.