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We present for the first time the development of 3-D solenoidal micro coils using an automatic wire bonder. By developing a stable and repeatable bond process with insulated wire, micro coils with sub-millimeter diameter have been manufactured. The winding process for a single coil takes about 200 ms, whereas the manufacture of a 100-coil-array takes less than a minute. Micro coils with 4 windings and a diameter of 690 p~ exhibit an inductance of 12.7 nH and a resistance of 580 yQ at 300 MHz. These values correspond to a quality factor of 41 and compare favorably to state-of-the-art micro coil manufacturing technologies.

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Accurate electrostatic simulations are required for the analysis of micro electromechanical systems (MEMS) and interconnects in very large scale integration (VLSI) design. Typical simulations involve complex three-dimensional (3-D) geometries together with various dielectric materials, conductors, and boundary conditions. The boundary element method is well suited for such computations. For highly accurate solutions, the meshing of the geometry becomes increasingly important. A scheme is presented which allows generating an optimal mesh automatically based on a coarse initial discretization, e.g., a CAD model. An error indicator derived from boundary integral equations monitors the solution accuracy in each boundary element. H-type or p-type mesh refinement is applied to areas which contribute strongly to the overall error. The method applies to both twodimensional (2-D) and 3-D simulations containing elements of various orders and shapes. The generated refined meshes result in significantly higher solution accuracy for a given simulation size.