Currently, the Brain Computer Interfaces (BCI) system was designed mostly to be implemented for control purpose or navigation which are mostly being employed for mobile robot, manipulator robot and humanoid robot by using Motor Imagery. This study presents an implementation of BCI system to Modular Self-Reconfigurable (MSR) Dtto robot so the robot able to propagate multiple configurations based on EEGbased brain signals. In this paper, a Neurosky's Mindwave Mobile EEG headset is being used and a framework of controlling the Dtto robot by EEG signals, processed by OpenViBE software are built. The connection being established between Neurosky's headsets to the OpenViBE, where a Motor Imagery BCI is created to receive and process the EEG data in real time. The main idea for system developed is to associate a direction (Left, Right, Up and Down) based on Hand and Feet Motor Imagery as a command for Dtto robot control. The Direction from OpenViBE were sent via Lab Streaming Layer (LSL) and transmitted via Python software to Arduino controller in the robots. To test the system performance, this study was conducted in Real time experiments. The results are being discussed in this paper.

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Material Transportation System (MTS) is required to move materials within a factory, warehouse, or other facilities. This study focused on AGV where the optimization of MTS is further studied. Although there is increasing demand in AGV control architecture, there is still unexplored potential in optimizing AGV performance measures. Applying AGVs in logistic factory may help in improving the efficiency in material flow and distribution among workstation at the right time and the right place. The aim of this study is to propose a simulation-based vehicle requirement analysis of AGVs in warehouse area with low mixed product variation. Simulations results show optimized number of AGV in warehouse area is achieved and succeed in produce short cycle time with high throughput.

Abstract. The commissioning of a high speed parallel robot such as the ABB Flexpicker Robot into the industrial environment provides greater flexibility in picking, packaging or palletizing tasks. However, current configuration of this robot only allows up to four-degree-of-freedom (DOF) which restricted its function to perform simple or complex automated assembly task. Therefore, the possibility of increasing one additional degree-of-freedom for the parallel robot was investigated. By attaching a flexible vacuum hose to the robot's end effector, it can be controlled by using a servomotor that can manipulate its angle of suction up to 90 degrees. With this new configuration, one DOF has been introduced for this robot. Several tests had been conducted to evaluate the flexibility and performance of the end effector which includes varying loads and angles. From the analysis, it is found that the end-effector can lift weights up to 1kg due to sufficient vacuum pressure; however, it could perform bending up to 90 degrees for maximum load of 600 grams only.

New formulations are produced for problems associated with multiple cracks in the upper part of thermoelectric-bonded materials subjected to remote stress using hypersingular integral equations (HSIEs). The modified complex stress potential function method with the continuity conditions of the resultant electric force and displacement electric function, and temperature and resultant heat flux being continuous across the bonded materials’ interface, is used to develop these HSIEs. The unknown crack opening displacement function, electric current density, and energy flux load are mapped into the square root singularity function using the curved length coordinate method. The new HSIEs for multiple cracks in the upper part of thermoelectric-bonded materials can be obtained by applying the superposition principle. The appropriate quadrature formulas are then used to find stress intensity factors, with the traction along the crack as the right-hand term with the help of the curved length coordinate method. The general solutions of HSIEs for crack problems in thermoelectric-bonded materials are demonstrated with two substitutions and it is strictly confirmed with rigorous proof that: (i) the general solutions of HSIEs reduce to infinite materials if G1=G2, K1=K2, and E1=E2, and the values of the electric parts are α1=α2=0 and λ1=λ2=0; (ii) the general solutions of HSIEs reduce to half-plane materials if G2=0, and the values of α1=α2=0, λ1=λ2=0 and κ2=0. These substitutions also partially validate the general solution derived from this study.