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The Stress Corrosion Crack (SCC) Growth Rate in Sensitized Alloy 600 in Thiosulfate Solution. -The effect of the applied potential on the SCC growth rate of sensitized Alloy 600 in 0.01 M Na2S2O3 solution at 25 • C is studied by a constant deflection technique using precracked samples. With increasing applied potential in the anodic passive region the intergranular SCC growth rate increases while the critical stress intensity factor for SCC (KISCC) decreases. At +500 mV in the transpassive potential region a retardation in the crack growth rate is possibly due to crack tip blunting resulting from fast dissolution around the crack tip. -(TSAI, W.-T.; SHEU, M.-J.; LEE, J.-T.;

An advanced method for LF (Lead Free) bump sample preparation to improve the surface of sample that can enhance the image of IMC (Inter Metallic Compound), solder grain boundary and micro-crack after TC (thermal cycle) reliability test is proposed. By this advanced method application, LF bump micro-crack location and propagation path can be observed easily for the reliability test fracture failure mechanism study and LF bump crack improvement further.