This paper presents the results of a study of a magnetorheological fluid (MRF) damper. The principle could be used for such applications as seismic protectors for civil structure (where the dimensions are chosen to handle the greatest forces) or shock absorbers for the automotive industry (where the dimensions are chosen to accommodate heating effects). We describe the preparation method and some characteristics of the MRF, the experimental method (we used a hydraulic linear motor and pressure measurements), and the main experimental results. The external force required to move the damper increases several times when the magnetic field is applied.

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Components soldered with Sn-based alloys are susceptible to the growth of whiskers. Tin whiskers have been proven to be responsible for equipment failures in a wide range of industries. In order to reduce defects in electronic components a new solder alloy is proposed based on the Sn-Cu alloys. The Sn-Cu-Ga alloy utilised in this study was fabricated as a ribbons using melt-spinning method. These ribbons were then soldered onto electroplated tin layers. Preliminary characterization of the solder alloy is presented in this paper, including scanning electron microscopy, EDX mapping and X-ray diffraction. Key words: tin whiskers, PCB, printed circuit boards, melt spinning, solder, ribbons