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This paper presents a fully integrated 60 GHz SiGe transceiver for industrial radar applications. The transceiver is packaged in an eWLB technology which allowes for direct embedding of two dipole antennas in the package. The compact transceiver frontend has been evaluated in an FMCW radar setup. The transceiver features a wide tunable operating range and is comprised of a vector modulator and a homodyne IQ receiver. The overall transceiver MMIC has a maximum output power of 3 dBm and an overall power consumption of less then 1 W. The directivity of the embedded antenna is 9 dBi and shows an operating bandwidth of 5 GHz.

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In this article, we present a study about the impact of embedded wafer level ball grid array (eWLB) on characteristics of antenna. The antenna in package is a promising solution for integration of antennas and eWLB technology enables integration of passive components and antennas into the redistribution layer (RDL). The antenna radiates perpendicular to the package in broadside into the package. There are different parameters such as size, shape, and thickness of the eWLB package which affect the radiation pattern significantly. Moreover, the materials properties of r impact the impedance bandwidth, gain and efficiency of antenna and have to be taken into account. The other important parameter to design the antenna in package is the distance of antenna to the reflector. We present the feasibility of an antenna with backside metallization as an integrated reflector in an 8 mm x 8 mm eWLB package. The measurement and simulation results show that eWLB is an attractive candidate for mm-wave applications.Index Terms -eWLB package, system-in-package, integrated antenna, antenna in package, millimeter wave radar.