60 GHz industrial radar systems in silicon-germanium technology

Abstract

This paper presents a fully integrated 60 GHz SiGe transceiver for industrial radar applications. The transceiver is packaged in an eWLB technology which allowes for direct embedding of two dipole antennas in the package. The compact transceiver frontend has been evaluated in an FMCW radar setup. The transceiver features a wide tunable operating range and is comprised of a vector modulator and a homodyne IQ receiver. The overall transceiver MMIC has a maximum output power of 3 dBm and an overall power consumption of less then 1 W. The directivity of the embedded antenna is 9 dBi and shows an operating bandwidth of 5 GHz.

Embedded wafer level ball grid array (eWLB) technology for high-frequency system-in-package applications

“…Fig. 5 shows a photograph of a fully integrated single-chip 60-GHz transceiver in SiGe integrated in the eWLB package with two dipole antennas [7]. The module has been developed for communication and radar applications at the license-free industrial, scientific and medical (ISM) band around 60 GHz.…”

“…Photograph of the 60-GHz transceiver in SiGe integrated in the eWLB package together with two dipole antennas realized in the RDL[7].…”

Design for the Package-Board Transition and Its Testability Design in the Fan-Out Wafer-Level Package

“…Since being introduced by Infineon in 2001 [1], because of the advantages of better thermal and electrical performance, lower cost, and good feasibility, fan-out wafer-level package (FOWLP) technology has been widely used in millimeter-wave applications [2][3][4][5][6][7][8]. Thanks to the researchers, various types of FOWLP have emerged: Freescale proposed the redistributed chip package in 2007 [9], IME extended the technology to multi-die packaging in 2008 [10] and demonstrated the reliability of 3D FOWLP [11], a package-on-package concept with the FOWLP was proposed by STATS ChipPAC in 2012 [12], TSMC also developed their InFo wafer-level packaging [13,14] at basic of the FOWLP, and in 2014, the Infineon applied the through encapsulant via (TEV) in embedded wafer level ball grid array (eWLB) for vertical interconnection [15].…”

Monostatic continuous-wave radar integrating a tunable wideband leakage canceler for indoor tagless localization

“…It should be specified that the proposed architecture is intended for indoor medical applications and, therefore, the situation and the challenges are different than the ones experienced in other applications, such as aviation, navigation, automotive industry, industrial plant facilities, and meteorology, e.g., the poor reflectivity of a person compared with objects, compactness, low costs. References [26–29] report two-antenna industrial radar systems. References [30, 31] report single-antenna SFCW radars for industrial applications, which involve high-directive and bulky antennas.…”