The inductively coupled plasma reactive ion etching (ICP-RIE) is a selective dry etching method used in fabrication technology of various semiconductor devices. The etching is used to form non-planar microstructures—trenches or mesa structures, and tilted sidewalls with a controlled angle. The ICP-RIE method combining a high finishing accuracy and reproducibility is excellent for etching hard materials, such as SiC, GaN or diamond. The paper presents a review of silicon carbide etching—principles of the ICP-RIE method, the results of SiC etching and undesired phenomena of the ICP-RIE process are presented. The article includes SEM photos and experimental results obtained from different ICP-RIE processes. The influence of O2 addition to the SF6 plasma as well as the change of both RIE and ICP power on the etching rate of the Cr mask used in processes and on the selectivity of SiC/Cr etching are reported for the first time. SiC is an attractive semiconductor with many excellent properties, that can bring huge potential benefits thorough advances in submicron semiconductor processing technology. Recently, there has been an interest in SiC due to its potential wide application in power electronics, in particular in automotive, renewable energy and rail transport.

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We present an optical signal coupling scheme for slab waveguide surface grating coupler sensors. The proposed solution is based on the use of polymer microlenses. In this work we analyze two types of compact polymer lenses: the aspheric plano-convex lenses and Fresnel lenses. The feasibility of the proposed scheme is demonstrated by the experimental investigation into the optical signal coupling to the test structure of TiO2-SiO2 slab waveguide surface grating coupler using both types of lenses.

The fabrication processes for silicon nitride photonic integrated circuits evolved from microelectronics components technology—basic processes have common roots and can be executed using the same type of equipment. In comparison to that of electronics components, passive photonic structures require fewer manufacturing steps and fabricated elements have larger critical dimensions. In this work, we present and discuss our first results on design and development of fundamental building blocks for silicon nitride integrated photonic platform. The scope of the work covers the full design and manufacturing chain, from numerical simulations of optical elements, design, and fabrication of the test structures to optical characterization and analysis the results. In particular, technological processes were developed and evaluated for fabrication of the waveguides (WGs), multimode interferometers (MMIs), and arrayed waveguide gratings (AWGs), which confirmed the potential of the technology and correctness of the proposed approach.

We report results of the current–voltage characteristics and low-frequency noise in Au nanoparticle (AuNP)-decorated graphene–Si Schottky barrier diodes. Measurements were conducted in ambient air with addition of either of two organic vapors, tetrahydrofuran [(CH2)4O; THF] and chloroform (CHCl3), as also during yellow light illumination (592 nm), close to the measured particle plasmon polariton frequency of the Au nanoparticle layer. We observed a shift of the DC characteristics at forward voltages (forward resistance region) when tetrahydrofuran vapor was admitted (in a Au-decorated graphene–Si Schottky diode), and a tiny shift under yellow irradiation when chloroform was added (in not decorated graphene–Si Schottky diode). Significantly larger difference in the low-frequency noise was observed for the two gases during yellow light irradiation, compared with no illumination. The noise intensity was suppressed by AuNPs when compared with noise in graphene–Si Schottky diode without an AuNP layer. We conclude that flicker noise generated in the investigated Au-decorated Schottky diodes can be utilized for gas detection.