Due to the possibilities in miniaturization and wearability, photoplethysmography (PPG) has recently gained a large interest not only for heart rate measurement, but also for estimating heart rate variability, which is derived from ECG by convention. The agreement between PPG and ECG-based HRV has been assessed in several studies, but the feasibility of PPG-based HRV estimation is still largely unknown for many conditions. In this study, we assess the feasibility of HRV estimation based on finger PPG during rest, mild physical exercise and mild mental stress. In addition, we compare different variants of signal processing methods including selection of fiducial point and outlier correction. Based on five minutes synchronous recordings of PPG and ECG from 15 healthy participants during each of these three conditions, the PPG-based HRV estimation was assessed for the SDNN and RMSSD parameters, calculated based on two different fiducial points (foot point and maximum slope), with and without outlier correction. The results show that HRV estimation based on finger PPG is feasible during rest and mild mental stress, but can give large errors during mild physical exercise. A good estimation is very dependent on outlier correction and fiducial point selection, and SDNN seems to be a more robust parameter compared to RMSSD for PPG-based HRV estimation.
This work demonstrates how a multielectrode array (MEA) dedicated to four-electrode bioimpedance measurements can be implemented on a complementary metal-oxide-semiconductor (CMOS) chip. As a proof of concept, an 8x8 pixel array along with dedicated amplifiers was designed and fabricated in the TSMC 180 nm process. Each pixel in the array contains a circular current carrying (CC) electrode that can act as a current source or sink. In order to measure a differential voltage between the pixels, each CC electrode is surrounded by a ring shaped pick up (PU) electrode. The differential voltages can be measured by an onboard instrumentation amplifier, while the currents can be measured with an on-bard transimpedance amplifier. Openings in the passivation layer exposed the aluminum top metal layer, and a metal stack of zinc, nickel and gold was deposited in an electroless plating process. The chips were then wire bonded to a ceramic package and prepared for wet experiments by encapsulating the bonding wires and pads in the photoresist SU-8. Measurements in liquids with different conductivities were performed to demonstrate the functionality of the chip.
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