With the ever increasing demands for high performance electronic devices there is a need for circuit board laminates that have enhanced properties when compared to conventional materials such as the widely used epoxide‐based FR4 laminates. Equipment manufacturers require boards with better mechanical stability and improved electrical characteristics. At the same time, new environmental legislation is set to drive electronics assembly temperatures much higher as manufacturers start to use lead‐free soldering processes. The legislation is also raising questions about the long‐term viability of brominated resins as the basis for imparting flame retardancy to laminates. Fortunately, laminate manufacturers have responded to these challenges by developing and introducing a wide range of new laminates that address these issues. This paper describes some of these challenges and gives an introduction to the new high performance laminates that are finding increasing use. It also highlights the need for chemical processes used in the manufacture of interconnects with laminates to be specifically optimised for the chosen substrate material.

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