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Nine different types of shunt have been found in state-of-the-art mono-and multicrystalline solar cells by lock-in thermography and identified by SEM investigation (including EBIC), TEM and EDX. These shunts differ by the type of their I-V characteristics (linear or nonlinear) and by their physical origin. Six shunt types are process-induced, and three are caused by grown-in defects of the material. The most important process-induced shunts are residues of the emitter at the edge of the cells, cracks, recombination sites at the cell edge, Schottky-type shunts below grid lines, scratches, and aluminum particles at the surface. The material-induced shunts are strong recombination sites at grown-in defects (e.g., metal-decorated small-angle grain boundaries), grown-in macroscopic Si 3 N 4 inclusions, and inversion layers caused by microscopic SiC precipitates on grain boundaries crossing the wafer.

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Mono- and multicrystalline solar cells have been stressed by potential-induced degradation (PID). Cell pieces with PID-shunts are imaged by SEM using the EBIC technique in plan view as well as after FIB cross-section preparation. A linear shaped signature is found in plan-view EBIC images at every potential-induced shunt position on both mono- and multicrystalline solar cells. Cross-sectional SEM and TEM images reveal stacking faults in a {111} plane. Combined TEM/EDX measurements show that the stacking faults are strongly decorated with sodium. Thus, the electric conductivity of stacking faults is assumed to arise under the influence of sodium ion movement through a high electric field across the SiNx anti-reflective layer, resulting in PID

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