The fabrication processes of p-type regions for vertical GaN power devices are investigated. A p-type body layer in a trench gate metal-oxide-semiconductor field-effect transistor requires precise control of the effective acceptor concentration, which is equal to the difference between the Mg acceptor concentration (Na) and the compensating donor concentration (Nd). The carbon atoms incorporated during growth via metalorganic vapor phase epitaxy substitute nitrogen sites (CN) and function as donor sources in a p-type GaN layer. Since interstitial H atoms (Hi) also compensate holes, their removal from an Mg-doped layer is crucial. Extended anneals to release H atoms cause the formation of extra hole traps. The p+ capping layer allows effective and rapid removal of H atoms from a p-type body layer owing to the electric field across the p+/p– junction. On the other hand, selective area p-type doping via Mg ion implantation is needed to control the electrical field distribution at the device edge. Ultrahigh-pressure annealing (UHPA) under a nitrogen pressure of 1 GPa enables post-implantation annealing up to 1753 K without thermal decomposition. Cathodoluminescence spectra and Hall-effect measurements suggest that the acceptor activation ratio improves dramatically by annealing above 1673 K as compared to annealing at up to 1573 K. High-temperature UHPA also induces Mg atom diffusion. We demonstrate that vacancy diffusion and the introduction of H atoms from the UHPA ambient play a key role in the redistribution of Mg atoms.

Sources of carrier compensation in n-type and p-type GaN layers grown by metalorganic vapor phase epitaxy were quantitatively identified by a combination of Hall-effect analysis and deep level transient spectroscopy. For n-type GaN, we identified three electron compensation sources: residual carbon atoms likely sitting on nitrogen sites (CN), an electron trap at the energy level of EC –0.6 eV (the E3 trap), and self-compensation appearing with increasing donor concentration. We showed that the CN also play a key role in hole compensation in p-type GaN by forming donor-like charged states. We also investigated the reduction of acceptor concentrations (Na) in highly Mg-doped GaN. Atomic-resolution scanning transmission electron microscopy revealed that electrically inactive Mg atoms of 3/2 atomic layers are segregated at the boundary of pyramidal inversion domains. The Na reduction can be explained by this Mg segregation.

The source of carrier compensation in metalorganic vapor phase epitaxy (MOVPE)-grown n-type GaN was quantitatively investigated by Hall-effect measurement, deep-level transient spectroscopy, and secondary ion mass spectrometry. These analysis techniques revealed that there were at least three different compensation sources. The carrier compensation for samples with donor concentrations below 5 × 1016 cm−3 can be explained by residual carbon and electron trap E3 (EC − 0.6 eV). For samples with higher donor concentrations, we found a proportional relationship between donor concentration and compensating acceptor concentration, which resulted from a third source of compensation. This is possibly due to the self-compensation effect.

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