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The impact of exposure doses on the demolding process in UV nanoimprint lithography ͑UV NIL͒ was studied. The PAK-01 resist was examined to investigate the dependence of the conversion ratio and elastic modulus on the adhesion force between the mold and the resist for various UV dosages. Also, adhesion forces between the resist and SiO 2 / Si mold were measured in various dosages. The results show that the adhesion force is unstable until the elastic modulus of the resist is enlarged enough even if the chemical conversion is completed by UV exposure. On the other hand, the demolding in the actual UV NIL experiment is not successful at lower dosages. Based on these evaluations, a suitable exposure dosage is suggested for successful demolding to realize a high throughput UV NIL process without demolding defects.

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