Indentation forming process is used for internal forming and sizing of thick-walled tubes working in high internal pressures. In this process, a mandrel with a diameter slightly larger than that of the tube is pressed and moved inside the tube, creating an internal profile. This article presents theoretically and experimentally influences of longitudinal ultrasonic vibration on this forming process. For this purpose, vibro-impact and continuous forming regimes have been investigated. Application of longitudinal ultrasonic vibration along the axis of the workpiece showed experimentally reduction of 15%-21% of axial forming forces and improvement of surface quality of the bore of the tube, while no effect on spring back of the formed zone was observed.

Temperature history and distribution of steel workpiece (X20Cr13) was measured by a high tech infrared camera under ultrasonic assisted dry creep feed up grinding. For this purpose, a special experimental setup was designed and fabricated to vibrate only workpiece along two directions by a high power ultrasonic transducer. In this study, ultrasonic effects with respect to grinding parameters including depth of cut (a), feed speed (v), and cutting speed (v) has been investigated. The results indicate that the ultrasonic vibration has considerable effect on reduction of temperature, depth of thermal damage of workpiece and width of temperature contours. Maximum temperature reduction of 25.91% was reported at condition of v=15m/s, v=500mm/min, a=0.4mm in the presence of ultrasonic vibration.

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Grinding hard-brittle materials like silicon nitride is faced with some challenges, including sub-surface damage, high tool wear, and low grinding efficiency. Ultrashort-pulse laser structuring of hard materials prior to the grinding process significantly reduces the cutting forces and temperature and increases the achievable material removal rate of the grinding process. These effects are partially due to controllable induced damages into the subsurface of the structured workpieces. However, the impacts of this surface structuring technique on the material removal mechanism of advanced ceramics, such as Si3N4, are not yet thoroughly investigated. The dominant material removal mechanism in grinding hard and brittle materials, such as silicon nitride (Si3N4), defines the surface integrity of the workpiece. For the first time, in-depth single diamond grit scratching experiments are carried out to investigate the changes in the dominant material removal mechanisms at various chip thicknesses by laser structuring of Si3N4. Two different structuring ratios (25% and 50%) were generated on sample surfaces by a femtosecond laser. The effects of laser structuring on material removal mechanism, pile-up area, area and width of the groove, grit path, normal and tangential forces, and specific cutting energy have been investigated. The results indicate that laser structuring considerably affects the reduction of depth ratio, normal (up to 89%) and tangential (up to 82%) forces, and specific cutting energy. The specific cutting energy of laser-structured Si3N4 workpieces converged to about 5 J/mm3, much lower than that of unstructured workpieces.

Ultrashort pulse laser structuring of hard materials prior to the grinding process significantly reduces the cutting forces and temperature and increases the achievable material removal rate of the grinding process. These effects are partially due to controllable induced damages into the subsurface of the structured workpieces. However, the impacts of this surface structuring technique on the material removal mechanism of advanced ceramics, such as Si3N4 are not yet thoroughly investigated. The dominant material removal mechanism in grinding hard and brittle materials such as silicon nitride (Si3N4), defines the surface integrity of the workpiece. For the first time, in-depth single diamond grit scratching experiments are carried out to investigate the changes in the dominant material removal mechanisms at various chip thicknesses by laser structuring of Si3N4. Two different structuring ratios (25% and 50%) were generated on sample surfaces by a femtosecond laser. The effects of laser structuring on material removal mechanism, pile-up area, area and width of the groove, grain path, normal and tangential forces, and specific cutting energy have been investigated. The results indicate that laser structuring considerably affects the reduction of depth ratio, normal (up to 89%) and tangential (up to 82%) forces, and specific cutting energy. The specific cutting energy of laser structured Si3N4 workpieces converged to about 5 J/mm3, much lower than that of unstructured workpieces.