Ductile-brittle transition mechanisms in micro-grinding of silicon nitride

Shamray, Serge; Azarhoushang, Bahman; Paknejad, Masih; Büchler, Andreas

doi:10.1016/j.ceramint.2022.08.088

Cited by 21 publications

(3 citation statements)

References 33 publications

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“…Therefore, considerable effort has been expended to achieve ductile grinding of hard and brittle crystals [17][18][19][20][21][22], to improve the processing efficiency by ensuring the surface integrity of the crystal components. Shamray et al [23] investigated the ductile-to-brittle transition behaviors of Si 3 N 4 ceramics, and a Si 3 N 4 substrate with a ductile surface and subsurface was obtained by controlling the maximum undeformed chip thickness. Yang et al [24] investigated the ductile removal phenomenon of 3C-SiC involved in precision grinding process.…”

Section: Introductionmentioning

confidence: 99%

Damage evolution and removal behaviors of GaN crystals involved in double-grits grinding

Li,

Hu,

Wei

et al. 2024

Int. J. Extrem. Manuf.

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Understanding the complex interactions between the work material and abrasives is a difficult and hot topic during grinding of Gallium nitride (GaN) single crystals. In this work, molecular dynamics (MD) simulations of double-grits interacted grinding of GaN crystals were performed, and the grinding force, coefficient of friction, stress distribution, plastic damage behaviors, and abrasive damage were systematically investigated. The results demonstrated that interacted distance with both radial and transverse directions achieved better grinding quality than that with only one direction or single-grit grinding. The grinding force, grinding induced stress, subsurface damage depth, and abrasive wear increases as the transverse interacted distance increases. However, the influence laws of the interacted distance on atom number of phase transition and dislocation length are not distinct. Appropriate interacted distances between abrasives can decrease grinding force, coefficient of friction, grinding induced stress, subsurface damage depth, and abrasive wear during the grinding process. Grinding test combined with the cross-sectional TEM detection verified the reliability of the simulated damage behaviors, i.e. amorphous, high-pressure phase transition, dislocations, stacking faults, and lattice distortions. The results not only enhance the understanding of damage accumulation and material removal caused by the coupling actions of abrasives in grinding process, but also provide a feasible approach for the wheel design of ordered abrasives.

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Section: Introductionmentioning

confidence: 99%

Damage evolution and removal behaviors of GaN crystals involved in double-grits grinding

Li,

Hu,

Wei

et al. 2024

Int. J. Extrem. Manuf.

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show abstract

“…Because of their hard and brittle characteristics, grinding has become the main processing method for ceramic parts [ 6 , 7 ]. In the process of grinding, high temperature, grinding wheel wear, surface burn, crack generation and crack propagation are very easy to occur, which not only reduces the service life of the grinding wheel but also seriously affects the processing quality, accuracy, and efficiency [ 8 ].…”

Section: Introductionmentioning

confidence: 99%

Effects of Grinding Parameters on the Processing Temperature, Crack Propagation and Residual Stress in Silicon Nitride Ceramics

et al. 2023

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The surface/subsurface damage of engineering ceramics after machining has a great influence on the service performance of parts. In order to obtain a high grinding surface quality of engineering ceramics, and take silicon nitride ceramic as a research object, a series of grinding experiments were carried out. The effects of grinding parameters on longitudinal crack propagation depth and the surface residual stress of silicon nitride ceramics were analyzed by grinding experiments, and the residual stress at the location of crack propagation was obtained. The variation in the grinding temperature under different grinding parameters was explored. The influences of the grinding temperature on crack propagation depth and surface residual stress were clarified, the distribution of residual stress along the depth direction was discussed, and the relationship between the residual stress and crack propagation was revealed. The results show that the residual compressive stress on the surface of silicon nitride ceramics decreases with the increase in the depth of crack propagation and the degree of surface brittle spalling. The residual stress at the location of the crack propagation was residual tensile stress. The crack propagation depth increased with the increase in the residual tensile stress. The research provides a reference for the realization of high-quality surfaces in the grinding of silicon nitride ceramics.

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“…Silicon nitride and other engineering ceramic materials are widely used in many important fields of civil industry and national defense science and technology industry due to their advantages of high strength and hardness at high temperatures, oxidation resistance, abrasion resistance, corrosion resistance, small coefficient of linear expansion, and excellent dielectric properties and toughening modification [1,2]. Currently, technical ceramics are processed mostly through precision grinding [3].…”

Section: Introductionmentioning

confidence: 99%

Investigations on materials removal mechanism during laser-assisted grinding silicon nitride ceramics

Ding,

Teng,

Guo

et al. 2023

Preprint

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Grinding of silicon nitride ceramics has been seen the existence of processing problems such as low processing efficiency and high grinding forces. In response to the problem this paper mainly analyzes the processing mechanism of the laser-assisted grinding process, simulates the grinding process of a single abrasive grain grinding the surface of the silicon nitride microgroove through the coupled simulation of the smooth particle hydrodynamics (SPH), and finite element method (FEM), and analyzes the change of the material removal process with the grinding force and the depth of damage. The simulation results show that the grinding force and damage depth are significantly reduced when the abrasive grain cuts in the position of microgroove proximity due to the change of microstructure on the crack extension direction. An indentation experiment was carried out on silicon nitride ceramics, when the indenter was pressed in the closer position of the microgroove, the diagonal crack of the indentation would be extended to the side of the microgroove, which showed reasonable agreement with simulation results. It also proved that the laser heat source had a softening effect on the material. Two kinds of microgroove surfaces with different groove spacings were designed, and the laser-induced surfaces were subject to grinding experiments. The experimental results show that compared with the non-groove surface, the micro-grooved surface can significantly reduce the grinding force and improve the machining efficiency, and modifying the parameters of the grinding process can impact the effectiveness of laser-assisted grinding in reducing grinding force.

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Ductile-brittle transition mechanisms in micro-grinding of silicon nitride

Cited by 21 publications

References 33 publications

Damage evolution and removal behaviors of GaN crystals involved in double-grits grinding

Damage evolution and removal behaviors of GaN crystals involved in double-grits grinding

Effects of Grinding Parameters on the Processing Temperature, Crack Propagation and Residual Stress in Silicon Nitride Ceramics

Investigations on materials removal mechanism during laser-assisted grinding silicon nitride ceramics

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