No abstract

A novel True Random Number Generator circuit fabricated in a 130nm HfO2-based resistive RAM process is presented. The generation of the random bit stream is based on a specific programming sequence applied to a dedicated memory array. In the proposed programming scheme, all the cells of the memory array are addressed at the same time while the current provided to the circuit is limited to program only a subset of the memory array, resulting in a stochastic distribution of cell resistance values. Some cells are switched in a low resistive state, other cells are slightly programmed to reach an intermediate resistance state, while the remaining cells maintain their initial high resistance state. Resistance values are next converted into a bit stream and confronted to National Institute of Standards and Technology (NIST) test benchmarks. The generated random bit stream has successfully passed twelve NIST tests out of fifteen. Compared to state-of-the-art resistive RAM-based true random number generators, our proposed methodology is the first one to leverage on programming current limitation at a memory array level.

While standalone Flash memories (NAND) are facing their physical limitations, the emergence of resistive switching memories (RRAM) is seen as a solution for high density, low cost and low energy NAND replacement candidate. However, it has been shown that deeply scaled, high density RRAM architectures, such as crosspoint, suffer of voltage drop effects (IR drop) in metal lines, periphery overhead and metal line charging time due to injected current during programming operations and sneaking currents through unselected bitcells. In this work, we first propose several innovative models for IRdrop, periphery overhead and array-line charging time accounting for in-array multiple bit-write operation. Then, we introduce a new methodology for crosspoint memory design to determine IRdrop, periphery overhead and timing associated with the optimal characteristics of 1 selector-1 resistance (1S1R) device. We apply the proposed methodology to various half metal pitch memory technology nodes (from 50nm to 15nm) and to several written word sizes (from 1 to 32 bits). We show that for 1 bit programmed per array, the RRAM programming current has to be lower than 30µA and the selector leakage current lower than 10nA and that limitations increase as soon as multiple bits are written simultaneously in the same array. This, suggests massively parallel multi-bank write of a small number of bits per array, as the best solution for the RRAM memories to be competitive with NAND memories