<p>By MEMS packaging test platform for bonding process of bonding temperature and bonding time, and test silicon specifications experimental study. Experimental results indicate that when the bonding voltage of 1200V, bonding temperature of 445⁰C to 455⁰C, bonding time is 60s,the void fraction is less than 5%.Glass and silicon wafer bonding quality can achieve the best. The experimental results in order to improve the glass silicon bonding quality provide the basis.</p>

In order to meet the requirements of output torque, efficiency and compact shape of micro-spindles for small parts machining, a two-stage axial micro air turbine spindle with an axial inlet and outlet is proposed. Based on the k-ω turbulence model of SST, the flow field and operation characteristics of the two-stage axial micro air turbine spindle were studied using computational fluid dynamics (CFD) combined with an experimental study. We obtained the air turbine spindle under different working conditions of the loss and torque characteristics. When the inlet pressure was 300 KPa, the output speed of the two-stage turbine was 100,000 rpm, 9% higher than that of a single-stage turbine output torque. The total torque reached 6.39 N·mm, and the maximum efficiency of the turbine and the spindle were 42.2% and 32.3%, respectively. Through the research on the innovative structure of the two-stage axial micro air turbine spindle, the overall performance of the principle prototype has been significantly improved and the problems of insufficient output torque and low working efficiency in high-speed micro-machining can be solved practically, which laid a solid foundation for improving the machining efficiency of small parts and reducing the size of micro machine tool.

<p>By MEMS packaging test platform for bonding process of bonding temperature and bonding time,and test silicon specifications experimental study.Firstly,according to the anodic bonding principle,the main factors to detemine the effect of bonding quality.Secodly,change the bonding temperature,bonding time,and test wafer size and other parameters,glass silicon bonding contrast test.Finally,the calculation and analysis of comparative test of each group is bonded porosity,summanrized the factors that affect the quality of the bonding and bonding to achieve the best results in the bonding conditions.Experimental results indicate that when the bonding voltage of 1200V,bonding temperature of 445-455c,bonding time is 60s,the void fractin is less than 5%.Glass and Silicon wafer bonding quality can achieve the best. The experimental results in order to improve the glass silicon bonding quaity provides the basis.</p>