The recovery of structural defects in gallium nitride (GaN) and aluminum nitride (AlN) after implantation of In+111 and Sr+89 in the dose range (0.1–3) 1013 cm−2 and ion energies of 60–400 keV has been investigated as a function of annealing temperature with emission channeling (EC) and perturbed γγ angular correlation spectroscopy. The implanted In and Sr atoms occupied substitutional sites in heavily perturbed surroundings of point defects after room temperature implantation. No amorphization of the lattice structure was observed. The point defects could be partly removed after annealing to 1473 K for 10–30 min. Lattice site occupation of implanted light alkalis, Na+24 in GaN and AlN as well as Li+8 in AlN, were also determined by EC as a function of implantation and annealing temperature. These atoms occupied mainly interstitial sites at room temperature. Lithium diffusion and the occupation of substitutional sites was observed in GaN and AlN at implantation temperatures above 700 K. A lattice site change was also observed for sodium in AlN, but not in GaN after annealing to 1073 K for 10 min.

Single crystalline GaN-layers were implanted with radioactive 167Tm and 169yb ions, and their lattice sites were determined using the emission channeling technique. After the decay of 167Tm to 167Er, photoluminescence studies were performed. Upon room temperature implantation, rare earth atoms immediately occupy relaxed substitutional sites with an average relaxation of about 0.025 nm. Isochronal annealing treatments up to 800 °C and co-implantation of oxygen to a dose an order of magnitude greater than that of the Tm or Yb do not influence the rare earth lattice sites. A variety of different rare earth related luminescence lines are observed, and co-implantation of oxygen strongly changes the line intensities.

Single crystalline GaN-layers were implanted with radioactive 111In ions. The lattice location of the ions and the recovery of the implantation induced damage was studied using the emission channeling technique and perturbed-γγ-angular-correlation spectroscopy as a function of the annealing temperature. We find the majority of indium atoms on substitutional sites even directly after room temperature implantation, but within a heavily disturbed surrounding. During isochronal annealing treatments in vacuum, a gradual recovery of the implantation damage takes place between 873 K and 1173 K. After 1173 K annealing about 50 % of the In atoms occupy substitutional lattice sites with defect free surroundings.

The measured lateral stability of polysilicon line structures on a Silicon Oxy-Nitride layer is presented. This has been measured by Lateral Force Microscopy (LFM) in order to understand how much force can be applied to the structure during a wet cleaning process with subsequent drying. The measured values in the lateral dimension are between 2 and 5 µN which is in the same range as expected by mechanical calculations. SEM micrographs of the damaged sites confirm a round breaking shape. The length of the broken line is around 0.5 to 1 µm with a lower limit of 0.5 µm which is similar to previously reported results on real damage produced by cleaning processes supported with Megasonic energy. The rupture in the AFM experiments occurs clearly in the polysilicon and not at the interfaces of the structure.

As the dimensions of the structures of integrated circuits shrink, the influence of particles on device yield becomes increasingly important. According to the cleaning requirements of the International Technology Roadmap for Semiconductors (ITRS) in 2007, particles of 32 nm and larger are believed to be detrimental to devices and thus have to be removed. To remove nano-particles with minimal substrate loss and no damage requires very dilute chemistries and sufficiently gentle physical forces in a cleaning process. In this work the performance of an aerosol spray based cleaning technique is evaluated with regard to the removal efficiency of nano-particles as well as substrate loss and structural damage.